作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
-=s7Q{O8Z 3DNow!(3D no waiting)
&5)Kg%r 3DPA(3D Positional Audio,3D定位音频)
wVP{R3 3DS(3D SubSystem,三维子系统)
w}K<,5I> ABS(Auto Balance System,自动平衡系统)
0^?(;AK AC(Audio Codec,音频多媒体数字信号编解码器)
:p%nQF,*f ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
VfAIx]Fa ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
yf2U-s AE(Atmospheric Effects,雾化效果)
]ta]OK{s" AFR(Alternate Frame Rendering,交替渲染技术)
|j#x}8[( AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
w%GEOIj} AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
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c/ AGU(Address Generation Units,地址产成单元)
~^w;`~L AH: Authentication Header,鉴定文件头
L'`W5B@ AHA(Accelerated Hub Architecture,加速中心架构)
aM,>LKNbQ AL: Artificial Life(人工生命)
GG/~)^VMe ALU(Arithmetic Logic Unit,算术逻辑单元)
0<Vw0%! AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
@{j'Pf' AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
v@&&5J| Anisotropic Filtering(各向异性过滤)
ijw'7d|, API(Application Programming Interfaces,应用程序接口)
0jro0f' APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
yOxJx7uD APM(Advanced Power Management,高级能源管理)
]}<wS]1 APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
?tQUZO ARP(Address Resolution Protocol,地址解析协议)
"AS;\-Jk ASC(Anti Static Coatings,防静电涂层)
GX4# IRq ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
g0 \c ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
IwiR2K ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
B!jT@b{ ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
+D&W!m ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
s,\!@[N ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
K)`,|q* \ AST(Average Seek time,平均寻道时间)
;sT7c1X^! ATA(AT Attachment,AT扩展型)
N^Xb_jg;J ATAPI(AT Attachment Packet Interface)
G sm5L<rx ATC(Access Time from Clock,时钟存取时间)
V)^nVD)e ATL: ActiveX Template Library(ActiveX模板库)
;Bd0 =C ATM(Asynchronous Transfer Mode,异步传输模式)
r%}wPN(?D ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
sV@kQ:
ATX: AT Extend(扩展型AT)
q%]0%S? Auxiliary Input(辅助输入接口)
,/BBG\mJ AV(Analog Video,模拟视频)
lCr AVI(Audio Video Interleave,音频视频插入)
;HlVU Back Buffer,后置缓冲
=q.2S;? Backface culling(隐面消除)
3gQQ,V.. BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
_8)9I?jH Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
)wQR2$x~ BCF(Boot Catalog File,启动目录文件)
9?:SxI;v Benchmarks:基准测试程序数值
-4mUGh1dy BGA(Ball Grid Array,球状矩阵排列)
ff**) Xdh BGA(Ball Grid Array,球状矩阵排列)
7[[XNJP BGA: Ball Grid Array(球状网格阵列)
EX7gTf# BHT(branch prediction table,分支预测表)
-\:pbR BIF(Boot Image File,启动映像文件)
.Vj;[p8 Bilinear Filtering(双线性过滤)
3+;]dqZ BIOS(Basic Input/Output System,基本输入/输出系统)
v<,?%(g)7 BLA: Bearn Landing Area(电子束落区)
qY]IX9'kV BMC(Black Matrix Screen,超黑矩阵屏幕)
cxFfAk\,en BOD(Bandwidth On Demand,弹性带宽运用)
{a- p/\U BOPS:Billion Operations Per Second,十亿次运算/秒
M;ac U~J bps(bit per second,位/秒)
*`>(K& BPU(Branch Processing Unit,分支处理单元)
U<|kA(5 Brach Pediction(分支预测)
r5xu#%hgp; BSD(Berkeley Software Distribution,伯克利软件分配代号)
r]iec{ ^ BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
_'JKPD[ BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
Xhe2 5 C2C: card-to-card interleaving,卡到卡交错存取
MR=>DcR CAD: computer-aided design,计算机辅助设计
zHw[`"[ CAM(Common Access Model,公共存取模型)
#(FG+Bk CAS(Column Address Strobe,列地址控制器)
+e. bO5Y CBR(Committed Burst Rate,约定突发速率)
_fz-fG 1 CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
D:sQHJ.y CCD(Charge Coupled Device,电荷连接设备)
v4kk4}lE CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
r3<yG"J86 CCM(Call Control Manager,拨号控制管理)
*IJctYJaX cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
<\|f;7/ CCS(Cut Change System)
Z#IRNFj CCT(Clock Cycle Time,时钟周期)
8
C @iD% CDR(CD Recordable,可记录光盘)
^|5bK_Z& CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
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CDRW(CD-Rewritable,可重复刻录光盘)
,kfUlv= CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
;]34l."85 CE(Consumer Electronics,消费电子)
m;)[gF CEM(cube environment mapping,立方环境映射)
$/ew'h9q Center Processing Unit Utilization,中央处理器占用率
;?"2sS!AHQ CEO(Chief Executive Officer,首席执行官)
id8a#&t] CG(Computer Graphics,计算机生成图像)
dU+28 CGI(Common Gateway Interface,通用网关接口)
]e@'9`G-' CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
rIR~YMv! CIEA: Commercial Internet Exchange Association,商业因特网交易协会
QXqBb$AXi, CIR(Committed Infomation Rate,约定信息速率)
+FRXTku( CISC(Complex Instruction Set Computing,复杂指令集计算机)
-&oJ@Aa CISC(Complex Instruction Set Computing,复杂指令集计算机)
6":=p:PT. CISC: Complex Instruction Set Computing(复杂指令结构)
23BzD^2a Clipping(剪贴纹理)
>y#<WB$i CLK(Clock Cycle,时钟周期)
4<CHwIRHY Clock Synthesizer,时钟合成器
eL[BH8l CLV(Constant Linear Velocity,恒定线速度)
USy^Y?~; CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
jXB<"bw CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
H]K(`)y}4 CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
2uu"0Rm% COB(Cache on board,板上集成缓存)
P#]%C COB(Cache on board,板上集成缓存)
L l\y2oJ COD(Cache on Die,芯片内集成缓存)
A I}29L3C COD(Cache on Die,芯片内集成缓存)
EH<rUv63 COM: Component Object Model(组件对象模式)
Dp4\rps COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
'+LC.l M compressed textures(压缩纹理)
DS0c0lsx Concurrent Command Engine,协作命令引擎
{>'GE16x COO(Chief Organizer Officer,首席管理官)
{{w5F2b((% CP: Ceramic Package(陶瓷封装)
cl:h'aG CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
fw Ooi'jb CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
ya8MjGo CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
sr1 `/
CPS: Certification Practice Statement(使用证明书)
u+"3l@Y# CPU(Center Processing Unit,中央处理器)
~'k.'O{ CPU: Centerl Processing Unit(中央处理器)
RuSKJ,T:9 CPU:Center Processing Unit,中央处理器
w}nc^6qH CRC: Cyclical Redundancy Check(循环冗余检查)
?_*X\En*3 CRT(Cathode Ray Tube,阴极射线管)
&6V[@gmD
CS(Channel Separation,声道分离)
UPQ?vh2F2 CSE(Configuration Space Enable,可分配空间)
|Am
+f. CSS(Common Command Set,通用指令集)
jz ;N&62| CSS: Cascading Style Sheets,层叠格式表
_{0'3tI7 CTO(Chief Technology Officer,首席技术官)
Wv!#B$J~U CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
q9 !)YP+w CTS(Clear to Send,清除发送)
<=2\xJfxB CVS(Compute Visual Syndrome,计算机视觉综合症)