作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
T;-&3 3DNow!(3D no waiting)
x4r\cL1! 3DPA(3D Positional Audio,3D定位音频)
,73J# 3DS(3D SubSystem,三维子系统)
s9>-Q"(y ABS(Auto Balance System,自动平衡系统)
[z'PdYQR/{ AC(Audio Codec,音频多媒体数字信号编解码器)
wi|'pKG ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
]N!8U_U3 ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
G0Eqo$W)S AE(Atmospheric Effects,雾化效果)
-hZlFAZi AFR(Alternate Frame Rendering,交替渲染技术)
fb0i6RC~& AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
&Egw94l AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
\_bk+}WJ]s AGU(Address Generation Units,地址产成单元)
( d#E16y AH: Authentication Header,鉴定文件头
>TK:&V AHA(Accelerated Hub Architecture,加速中心架构)
\Z{6j&; AL: Artificial Life(人工生命)
\7n ;c ALU(Arithmetic Logic Unit,算术逻辑单元)
3WHj|ENW AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
x\z*iv AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
)*}2L_5] Anisotropic Filtering(各向异性过滤)
{ZP0%MD API(Application Programming Interfaces,应用程序接口)
7k.=_Tl APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
@eU;oRVc{ APM(Advanced Power Management,高级能源管理)
=]X_wA;% APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
]|KOc& y:I ARP(Address Resolution Protocol,地址解析协议)
zy^t95/m ASC(Anti Static Coatings,防静电涂层)
ecfw[4B` ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
G~b/!clN ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
i|?EgGFG ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
,UNCBnv1 ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
FZf{kWH ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
}TI"j{(QJ ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
J$Uj@M AST(Average Seek time,平均寻道时间)
l6]:Zcd0 ATA(AT Attachment,AT扩展型)
l.[S.@\ =. ATAPI(AT Attachment Packet Interface)
SM;UNIRVE ATC(Access Time from Clock,时钟存取时间)
wK>a&`< ATL: ActiveX Template Library(ActiveX模板库)
us%dw& ATM(Asynchronous Transfer Mode,异步传输模式)
2l^hnog| ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
VJviX[V?4 ATX: AT Extend(扩展型AT)
6AD#x7drj Auxiliary Input(辅助输入接口)
X`
r~cc AV(Analog Video,模拟视频)
L?:.8k`d AVI(Audio Video Interleave,音频视频插入)
cih[A2lp Back Buffer,后置缓冲
Q"rQVO Backface culling(隐面消除)
PWUS@I BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
zmaf@T Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
m3[R BCF(Boot Catalog File,启动目录文件)
.nh }f}j Benchmarks:基准测试程序数值
*L7&P46 BGA(Ball Grid Array,球状矩阵排列)
onqfmQ,3E BGA(Ball Grid Array,球状矩阵排列)
.{r 0Szm. BGA: Ball Grid Array(球状网格阵列)
}^3CG9% BHT(branch prediction table,分支预测表)
X0G6Wp BIF(Boot Image File,启动映像文件)
r Z)?uqa Bilinear Filtering(双线性过滤)
\zOo[/-< BIOS(Basic Input/Output System,基本输入/输出系统)
OynQlQD/Eu BLA: Bearn Landing Area(电子束落区)
($s%5| BMC(Black Matrix Screen,超黑矩阵屏幕)
noI>Fw<V BOD(Bandwidth On Demand,弹性带宽运用)
IP<]a5 BOPS:Billion Operations Per Second,十亿次运算/秒
>(T)9fKF bps(bit per second,位/秒)
?D[9-K4Vn BPU(Branch Processing Unit,分支处理单元)
X^Dklqqy Brach Pediction(分支预测)
nSR7$yS_ BSD(Berkeley Software Distribution,伯克利软件分配代号)
eI99itDQ BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
Q1hHK'3w BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
iR(=<> C2C: card-to-card interleaving,卡到卡交错存取
:qlcN @_ CAD: computer-aided design,计算机辅助设计
tAPn? d5 CAM(Common Access Model,公共存取模型)
GS_+KR\ CAS(Column Address Strobe,列地址控制器)
lJlyfN CBR(Committed Burst Rate,约定突发速率)
<yt|!p-tS CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
#7(?B{i CCD(Charge Coupled Device,电荷连接设备)
"wqN,}bj\ CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
%BBM%Lj CCM(Call Control Manager,拨号控制管理)
':fq/k3;& cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
Hst]}g' . CCS(Cut Change System)
*n]f) Jc CCT(Clock Cycle Time,时钟周期)
#POVu|Y;h CDR(CD Recordable,可记录光盘)
naOCa CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
4gKu8G CDRW(CD-Rewritable,可重复刻录光盘)
7# !RX3 CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
Ov<EOK+^ CE(Consumer Electronics,消费电子)
'\g-z CEM(cube environment mapping,立方环境映射)
I!-"SuBy4J Center Processing Unit Utilization,中央处理器占用率
ut/3?E1 Z CEO(Chief Executive Officer,首席执行官)
Yf&P|Iiw CG(Computer Graphics,计算机生成图像)
ECW=865jL CGI(Common Gateway Interface,通用网关接口)
' v)@K0P CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
-/)>DOgUq CIEA: Commercial Internet Exchange Association,商业因特网交易协会
L[s7q0 F`l CIR(Committed Infomation Rate,约定信息速率)
z:gp\ CISC(Complex Instruction Set Computing,复杂指令集计算机)
r~2>_LK CISC(Complex Instruction Set Computing,复杂指令集计算机)
'aV/\a:* CISC: Complex Instruction Set Computing(复杂指令结构)
NQ&\t[R[ Clipping(剪贴纹理)
yq7gBkS CLK(Clock Cycle,时钟周期)
~(v7:? Clock Synthesizer,时钟合成器
)/87<Y;o CLV(Constant Linear Velocity,恒定线速度)
B:X,vE CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
=5l20
Um CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
\mo NpKf CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
IJ[r!&PY COB(Cache on board,板上集成缓存)
(D5sJ$&E@\ COB(Cache on board,板上集成缓存)
cVb&Jzd COD(Cache on Die,芯片内集成缓存)
Mn>/\e COD(Cache on Die,芯片内集成缓存)
a%g |E'\Jw COM: Component Object Model(组件对象模式)
(i 2R1HCa COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
uE'O}Y95 compressed textures(压缩纹理)
b@s6jNhVO^ Concurrent Command Engine,协作命令引擎
>(.GIR COO(Chief Organizer Officer,首席管理官)
AX{X:L8Ut2 CP: Ceramic Package(陶瓷封装)
f\+ E&p. CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
f$y`tT %o CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
70Z#Ej CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
j-$F@p_2F CPS: Certification Practice Statement(使用证明书)
`>1XL 2 CPU(Center Processing Unit,中央处理器)
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CPU: Centerl Processing Unit(中央处理器)
'r0kX|| CPU:Center Processing Unit,中央处理器
U\'HB.P\ CRC: Cyclical Redundancy Check(循环冗余检查)
_/c1b>kcso CRT(Cathode Ray Tube,阴极射线管)
7$zeRYD+ CS(Channel Separation,声道分离)
#Ch*a.tI@ CSE(Configuration Space Enable,可分配空间)
~vPR9\e CSS(Common Command Set,通用指令集)
.D8|_B CSS: Cascading Style Sheets,层叠格式表
Tf*DFyr CTO(Chief Technology Officer,首席技术官)
4AWL::FU5 CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
=tS#t+2S CTS(Clear to Send,清除发送)
V$?@
z>7 CVS(Compute Visual Syndrome,计算机视觉综合症)