作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
xK_oV+ 3DNow!(3D no waiting)
,ryL("G 3DPA(3D Positional Audio,3D定位音频)
#?V rt,n 3DS(3D SubSystem,三维子系统)
Inn{mmz
1 ABS(Auto Balance System,自动平衡系统)
%pxO<O AC(Audio Codec,音频多媒体数字信号编解码器)
*\(z"B ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
* k<@ ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
{0j_.XZ AE(Atmospheric Effects,雾化效果)
[F'|KcE3 AFR(Alternate Frame Rendering,交替渲染技术)
3%hq< AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
:PtZKt;~X AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
dt^h9I2O AGU(Address Generation Units,地址产成单元)
fvcS=nRQv AH: Authentication Header,鉴定文件头
?^M,Mt AHA(Accelerated Hub Architecture,加速中心架构)
*yaS^k\ AL: Artificial Life(人工生命)
0y6M;"&~E ALU(Arithmetic Logic Unit,算术逻辑单元)
&!OEd] AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
dFF=-_O> AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
,2^4"gIl Anisotropic Filtering(各向异性过滤)
&w#! API(Application Programming Interfaces,应用程序接口)
j:xC\b47" APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
iaCV8`&q% APM(Advanced Power Management,高级能源管理)
~MBPN4r APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
b>Y{,`E3 ARP(Address Resolution Protocol,地址解析协议)
R(`:~@3\6 ASC(Anti Static Coatings,防静电涂层)
!?(7g2NP) ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
tAF?.\x"g ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
#{PwEX
!Ct ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
,zltNbu\.( ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
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5NuFLOf ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
8AX_y3$ ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
:nQlS AST(Average Seek time,平均寻道时间)
]"lB!O~ ATA(AT Attachment,AT扩展型)
7jgj;% ATAPI(AT Attachment Packet Interface)
m1U:&{:^ ATC(Access Time from Clock,时钟存取时间)
T!8^R|!a6 ATL: ActiveX Template Library(ActiveX模板库)
](A2,F
9(U ATM(Asynchronous Transfer Mode,异步传输模式)
T*f/M ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
>WIc"y. ATX: AT Extend(扩展型AT)
xbm%+ Auxiliary Input(辅助输入接口)
]S%(l, AV(Analog Video,模拟视频)
l6y}>] AVI(Audio Video Interleave,音频视频插入)
W3:Fw6v Back Buffer,后置缓冲
nuXL{tg6 Backface culling(隐面消除)
0]kKF<s BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
sl `jovT[Y Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
p,goYF?? BCF(Boot Catalog File,启动目录文件)
lQ-<T<g Benchmarks:基准测试程序数值
Jsysk $R BGA(Ball Grid Array,球状矩阵排列)
!R"W2 Z4h BGA(Ball Grid Array,球状矩阵排列)
\gk.[={^P BGA: Ball Grid Array(球状网格阵列)
-}9^$}PR BHT(branch prediction table,分支预测表)
mAtqF
%V BIF(Boot Image File,启动映像文件)
EU %,tp Bilinear Filtering(双线性过滤)
^>?=L\[ BIOS(Basic Input/Output System,基本输入/输出系统)
!:^q_q4 BLA: Bearn Landing Area(电子束落区)
3o%vV* BMC(Black Matrix Screen,超黑矩阵屏幕)
I70c,4_G BOD(Bandwidth On Demand,弹性带宽运用)
C !j3@EZ$ BOPS:Billion Operations Per Second,十亿次运算/秒
r5}p . bps(bit per second,位/秒)
Ti%MOYNCv BPU(Branch Processing Unit,分支处理单元)
D&G6^ME Brach Pediction(分支预测)
E^1yU BSD(Berkeley Software Distribution,伯克利软件分配代号)
}QFL BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
YThVG0I = BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
W,xdj! ^t C2C: card-to-card interleaving,卡到卡交错存取
sbW+vc CAD: computer-aided design,计算机辅助设计
2d D"^z{ CAM(Common Access Model,公共存取模型)
o,*m,Qc CAS(Column Address Strobe,列地址控制器)
uUI#^ A CBR(Committed Burst Rate,约定突发速率)
Qr.{_M CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
@dWA1tM CCD(Charge Coupled Device,电荷连接设备)
~}.C*;J CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
g\q . CCM(Call Control Manager,拨号控制管理)
C/k#gLF` cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
6}^x#9\ CCS(Cut Change System)
J,=K1>8s CCT(Clock Cycle Time,时钟周期)
74Jx \(d CDR(CD Recordable,可记录光盘)
'Z{`P0/^o` CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
.]v>LsbhF CDRW(CD-Rewritable,可重复刻录光盘)
OrkcY39"~a CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
zg2d}"dV CE(Consumer Electronics,消费电子)
!j6k]BgZ CEM(cube environment mapping,立方环境映射)
JtFq/&{i Center Processing Unit Utilization,中央处理器占用率
8<VDp Y CEO(Chief Executive Officer,首席执行官)
/5,6{R9 CG(Computer Graphics,计算机生成图像)
ef)RlzLOq CGI(Common Gateway Interface,通用网关接口)
Z",0 $Gxu CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
T|~5dZL CIEA: Commercial Internet Exchange Association,商业因特网交易协会
Et 0gPX- CIR(Committed Infomation Rate,约定信息速率)
>ywl()4O CISC(Complex Instruction Set Computing,复杂指令集计算机)
iJ{axa & CISC(Complex Instruction Set Computing,复杂指令集计算机)
+ ~V%R{h CISC: Complex Instruction Set Computing(复杂指令结构)
T"g_a|7Tj Clipping(剪贴纹理)
mB`HPT CLK(Clock Cycle,时钟周期)
7ys' [G|}r Clock Synthesizer,时钟合成器
&lzY"Y*hA0 CLV(Constant Linear Velocity,恒定线速度)
4@{;z4*` CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
< se ~wR CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
=oSD)z1c?x CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
ToHx!,tDS COB(Cache on board,板上集成缓存)
<aPZE6z COB(Cache on board,板上集成缓存)
Y1Ql_ COD(Cache on Die,芯片内集成缓存)
r*{.|>me COD(Cache on Die,芯片内集成缓存)
o6u^hG6~' COM: Component Object Model(组件对象模式)
/[/L%;a'p COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
"-:H$ compressed textures(压缩纹理)
-c>3|bo Concurrent Command Engine,协作命令引擎
L 0Ckw},, COO(Chief Organizer Officer,首席管理官)
Y$OE[nGi%X CP: Ceramic Package(陶瓷封装)
:a8Sy(" CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
%RW*gUvc] CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
T$kuv`? CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
nzbVI CPS: Certification Practice Statement(使用证明书)
ZKI8x1>Iq CPU(Center Processing Unit,中央处理器)
zW`Hqt; CPU: Centerl Processing Unit(中央处理器)
H7uh"/A CPU:Center Processing Unit,中央处理器
~vYFQKrb CRC: Cyclical Redundancy Check(循环冗余检查)
Ifp8oL? S; CRT(Cathode Ray Tube,阴极射线管)
UK6x]tE CS(Channel Separation,声道分离)
6EY\ CSE(Configuration Space Enable,可分配空间)
=o~mZ/ 7=M CSS(Common Command Set,通用指令集)
,tXI*R CSS: Cascading Style Sheets,层叠格式表
%Ja0:e CTO(Chief Technology Officer,首席技术官)
?jmL4V2-f CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
GYtgw9 "Y CTS(Clear to Send,清除发送)
odL*_<Z CVS(Compute Visual Syndrome,计算机视觉综合症)