作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
;qG a|`#j 3DNow!(3D no waiting)
4~Lw:o1a 3DPA(3D Positional Audio,3D定位音频)
tkNuM0 3DS(3D SubSystem,三维子系统)
prIq9U|@ ABS(Auto Balance System,自动平衡系统)
P d*}0a~ AC(Audio Codec,音频多媒体数字信号编解码器)
Z [68ji] ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
$5il]D` ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
#i)h0ML/e AE(Atmospheric Effects,雾化效果)
0FEb[+N AFR(Alternate Frame Rendering,交替渲染技术)
'e{e>>03 AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
e^Jy-?E AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
~j F5%Gu AGU(Address Generation Units,地址产成单元)
63:ZDQ AH: Authentication Header,鉴定文件头
[DjdR_9*I AHA(Accelerated Hub Architecture,加速中心架构)
J
fsCkS AL: Artificial Life(人工生命)
__3Cjo^6& ALU(Arithmetic Logic Unit,算术逻辑单元)
z %mM#X AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
`@Kh>K AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
.bL{fBTT~ Anisotropic Filtering(各向异性过滤)
9W'#4 API(Application Programming Interfaces,应用程序接口)
d&R/f Im APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
m;Sw`nw? APM(Advanced Power Management,高级能源管理)
E37`g}ZS APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
.HGEddcC ARP(Address Resolution Protocol,地址解析协议)
H+*o @0C\~ ASC(Anti Static Coatings,防静电涂层)
eDTEy;^o ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
FA4bv9:hi ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
?bN8h)>QQ8 ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
8iX?4qj{P ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
kFuaLEJi ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
[lyB@) 6. ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
fa<83<.D AST(Average Seek time,平均寻道时间)
W P.6ea7k ATA(AT Attachment,AT扩展型)
HESwz{eSS ATAPI(AT Attachment Packet Interface)
!f7}5/YC7v ATC(Access Time from Clock,时钟存取时间)
Qj0@^LA ATL: ActiveX Template Library(ActiveX模板库)
'1.T-.4>& ATM(Asynchronous Transfer Mode,异步传输模式)
UN,@K9 ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
NSM-p.I9 ATX: AT Extend(扩展型AT)
qx`*]lX Auxiliary Input(辅助输入接口)
W0gaOew(^ AV(Analog Video,模拟视频)
! daXF&q AVI(Audio Video Interleave,音频视频插入)
9LCV"xgX Back Buffer,后置缓冲
)(75dUl Backface culling(隐面消除)
%&z9^}Vd[ BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
&x;v& Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
hnG'L*HooE BCF(Boot Catalog File,启动目录文件)
$!KV]] Benchmarks:基准测试程序数值
m_(+-G BGA(Ball Grid Array,球状矩阵排列)
{f3T !e{ BGA(Ball Grid Array,球状矩阵排列)
jQsucs5$h BGA: Ball Grid Array(球状网格阵列)
>@y5R^B` BHT(branch prediction table,分支预测表)
i:{a-Bd BIF(Boot Image File,启动映像文件)
6 D~b9e Bilinear Filtering(双线性过滤)
H!oP!rzEo BIOS(Basic Input/Output System,基本输入/输出系统)
)v
['p BLA: Bearn Landing Area(电子束落区)
C=9|K`g5 R BMC(Black Matrix Screen,超黑矩阵屏幕)
r7w&p.? BOD(Bandwidth On Demand,弹性带宽运用)
M}M. BOPS:Billion Operations Per Second,十亿次运算/秒
*"1]NAz+ bps(bit per second,位/秒)
\zgRzO'N BPU(Branch Processing Unit,分支处理单元)
H={fY:% Brach Pediction(分支预测)
bl}$x/
BSD(Berkeley Software Distribution,伯克利软件分配代号)
e&]XiV' BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
E: XzX Fxx BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
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:(D7Cq C2C: card-to-card interleaving,卡到卡交错存取
dsJ}C|N CAD: computer-aided design,计算机辅助设计
^qV*W1|0 CAM(Common Access Model,公共存取模型)
k)y0V:ZY]O CAS(Column Address Strobe,列地址控制器)
("H:T?4Qs CBR(Committed Burst Rate,约定突发速率)
$K;4=zN>t: CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
IVEvu3 CCD(Charge Coupled Device,电荷连接设备)
`db++Z'C CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
oPre$YT}h CCM(Call Control Manager,拨号控制管理)
$@Hw DRP cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
p?8>9 CCS(Cut Change System)
`\O[9.B CCT(Clock Cycle Time,时钟周期)
u5T\_0 CDR(CD Recordable,可记录光盘)
%2/WyD$U CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
mL3'/3-7:V CDRW(CD-Rewritable,可重复刻录光盘)
?]$.3azO CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
jd(=? !_ CE(Consumer Electronics,消费电子)
(Dc dR:/= CEM(cube environment mapping,立方环境映射)
N}.h_~6 Center Processing Unit Utilization,中央处理器占用率
p3sz32RX CEO(Chief Executive Officer,首席执行官)
a>""MC2 CG(Computer Graphics,计算机生成图像)
h2uO+qEsu CGI(Common Gateway Interface,通用网关接口)
x ?Q;o+2v CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
jY$|_o.4 CIEA: Commercial Internet Exchange Association,商业因特网交易协会
-41L^Di\ CIR(Committed Infomation Rate,约定信息速率)
q(a6@6f"kD CISC(Complex Instruction Set Computing,复杂指令集计算机)
YZ/mTQn_D CISC(Complex Instruction Set Computing,复杂指令集计算机)
KX`MX5?x CISC: Complex Instruction Set Computing(复杂指令结构)
9$#2+G!J Clipping(剪贴纹理)
V3F2Z_VH2 CLK(Clock Cycle,时钟周期)
#4~Ivj Clock Synthesizer,时钟合成器
bumS>: CLV(Constant Linear Velocity,恒定线速度)
!m]76=@ CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
js k<N CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
C{e:xGJK CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
uXK$5" COB(Cache on board,板上集成缓存)
Yxi.A$g COB(Cache on board,板上集成缓存)
)[%#HT COD(Cache on Die,芯片内集成缓存)
9)H~I/9Y COD(Cache on Die,芯片内集成缓存)
E%/E%9-7\ COM: Component Object Model(组件对象模式)
U
.e Urzu COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
_3kAN.g compressed textures(压缩纹理)
iCz,|;w% Concurrent Command Engine,协作命令引擎
J*$ !^\s COO(Chief Organizer Officer,首席管理官)
*B@<{x r CP: Ceramic Package(陶瓷封装)
+a;:7[%& CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
Qv']*C[!z CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
/R
F#B#9 CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
-+O8v;aC' CPS: Certification Practice Statement(使用证明书)
k('2K2P CPU(Center Processing Unit,中央处理器)
&b{L|I'KYT CPU: Centerl Processing Unit(中央处理器)
7!L"ef62o CPU:Center Processing Unit,中央处理器
+F+jC9j(< CRC: Cyclical Redundancy Check(循环冗余检查)
]sbu9O ^"f CRT(Cathode Ray Tube,阴极射线管)
#[Ns\%Ri0 CS(Channel Separation,声道分离)
ZTHrjW1 CSE(Configuration Space Enable,可分配空间)
t'R&$;z@b CSS(Common Command Set,通用指令集)
U'Vz
CSS: Cascading Style Sheets,层叠格式表
5k<HO _] CTO(Chief Technology Officer,首席技术官)
l|5ss{llR CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
<3ovCqa CTS(Clear to Send,清除发送)
YzEa?F*$ CVS(Compute Visual Syndrome,计算机视觉综合症)