作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
Paq4 3DNow!(3D no waiting)
wm@@$ 3DPA(3D Positional Audio,3D定位音频)
j_[tu!~ 3DS(3D SubSystem,三维子系统)
+E+p"7 ABS(Auto Balance System,自动平衡系统)
z9Mfd#5?>P AC(Audio Codec,音频多媒体数字信号编解码器)
dDMJ' ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
iMh#TUlQEQ ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
i"FtcP^ AE(Atmospheric Effects,雾化效果)
zk+9'r`-D AFR(Alternate Frame Rendering,交替渲染技术)
{z|)Njhg AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
@bLy,Xr& AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
B@))8.h] AGU(Address Generation Units,地址产成单元)
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TdLDJR AH: Authentication Header,鉴定文件头
I{&[[7H AHA(Accelerated Hub Architecture,加速中心架构)
59L\|OR AL: Artificial Life(人工生命)
v~C
Czg ALU(Arithmetic Logic Unit,算术逻辑单元)
:4w ?# AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
A@('pA85 AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
3&4(ZH= Anisotropic Filtering(各向异性过滤)
}6~hEc*/" API(Application Programming Interfaces,应用程序接口)
M0"_^? APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
y<3-?}.aZ APM(Advanced Power Management,高级能源管理)
e{H=dIa+ APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
V &T~zh1 ARP(Address Resolution Protocol,地址解析协议)
MJ)RvNF ASC(Anti Static Coatings,防静电涂层)
8W7J3{d ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
3M`M ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
Lb-OsKU ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
]5cT cX;Z# ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
?UR0:f:}oc ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
}v{LRRi ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
$wa{~' AST(Average Seek time,平均寻道时间)
LOYk9m ATA(AT Attachment,AT扩展型)
G!##X: 6' ATAPI(AT Attachment Packet Interface)
VQ@ ATC(Access Time from Clock,时钟存取时间)
e%M;?0j ATL: ActiveX Template Library(ActiveX模板库)
=XQ%t
@z0 ATM(Asynchronous Transfer Mode,异步传输模式)
{S\{Ii6 ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
?z+eWL ATX: AT Extend(扩展型AT)
{YC@T(
Auxiliary Input(辅助输入接口)
d-ko
^Y0 AV(Analog Video,模拟视频)
j;r-NCBnz AVI(Audio Video Interleave,音频视频插入)
{Xy5pfW
Q Back Buffer,后置缓冲
JR|ck=tq Backface culling(隐面消除)
1I6px$^E\ BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
r;2^#6/Z Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
.Hm>i BCF(Boot Catalog File,启动目录文件)
>:!5*E5? Benchmarks:基准测试程序数值
/N.b%M]! BGA(Ball Grid Array,球状矩阵排列)
M_f:A BGA(Ball Grid Array,球状矩阵排列)
r5/0u(\LB BGA: Ball Grid Array(球状网格阵列)
T>Z<]s BHT(branch prediction table,分支预测表)
0mVNQxHI BIF(Boot Image File,启动映像文件)
\@zHON( Bilinear Filtering(双线性过滤)
gJ{)-\ BIOS(Basic Input/Output System,基本输入/输出系统)
Fo_sgv8O< BLA: Bearn Landing Area(电子束落区)
H?Wya.7 BMC(Black Matrix Screen,超黑矩阵屏幕)
gQuw1 BOD(Bandwidth On Demand,弹性带宽运用)
J;e2&gB BOPS:Billion Operations Per Second,十亿次运算/秒
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s5D bps(bit per second,位/秒)
0+ '&`Q!u BPU(Branch Processing Unit,分支处理单元)
5tkAFb4P Brach Pediction(分支预测)
=qIp2c}Rx BSD(Berkeley Software Distribution,伯克利软件分配代号)
B$K=\6o BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
Q&;9x? e BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
?V=ZIGj C2C: card-to-card interleaving,卡到卡交错存取
ru%y CAD: computer-aided design,计算机辅助设计
w9imKVry CAM(Common Access Model,公共存取模型)
*^4"5X@ CAS(Column Address Strobe,列地址控制器)
n>XdU%& CBR(Committed Burst Rate,约定突发速率)
<lPG=Xt CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
JQI: sj CCD(Charge Coupled Device,电荷连接设备)
q;CiV CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
A)!*]o>U CCM(Call Control Manager,拨号控制管理)
x,-75 cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
J@'wf8Ub CCS(Cut Change System)
"S]TP$O D CCT(Clock Cycle Time,时钟周期)
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%*@F CDR(CD Recordable,可记录光盘)
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i0_hZ CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
BWrxunHO CDRW(CD-Rewritable,可重复刻录光盘)
BU_nh+dF CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
AT3Mlz~7# CE(Consumer Electronics,消费电子)
tNI^@xdim1 CEM(cube environment mapping,立方环境映射)
X_h}J=33Q Center Processing Unit Utilization,中央处理器占用率
cT,sh~-x, CEO(Chief Executive Officer,首席执行官)
7}>E J CG(Computer Graphics,计算机生成图像)
LRA8p<Rs CGI(Common Gateway Interface,通用网关接口)
n84|{l581 CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
\2$|Ei7 CIEA: Commercial Internet Exchange Association,商业因特网交易协会
\8cx6 G' CIR(Committed Infomation Rate,约定信息速率)
KpGhQdR# CISC(Complex Instruction Set Computing,复杂指令集计算机)
D>q9 3;p CISC(Complex Instruction Set Computing,复杂指令集计算机)
Otuf]B^s CISC: Complex Instruction Set Computing(复杂指令结构)
S\=Nn7" Clipping(剪贴纹理)
)t#W{Gzfmh CLK(Clock Cycle,时钟周期)
TJRCH>E[a Clock Synthesizer,时钟合成器
##*3bDf$-5 CLV(Constant Linear Velocity,恒定线速度)
R 9\*#c CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
3pKQ$\u CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
K%oG,-wdg CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
D,feF9 COB(Cache on board,板上集成缓存)
?tbrbkx COB(Cache on board,板上集成缓存)
bn5 Su=] COD(Cache on Die,芯片内集成缓存)
25?6gu*Z COD(Cache on Die,芯片内集成缓存)
ICQKP1WFp COM: Component Object Model(组件对象模式)
.q>iXE_c COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
Lf&kv7Wj compressed textures(压缩纹理)
bAMdI 5Zk? Concurrent Command Engine,协作命令引擎
+e``OeXog COO(Chief Organizer Officer,首席管理官)
L0o\J` : CP: Ceramic Package(陶瓷封装)
GTd,n= CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
.k !{* CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
MTn{d CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
(<9u-HF# CPS: Certification Practice Statement(使用证明书)
]=BB# CPU(Center Processing Unit,中央处理器)
4hj|cCrO CPU: Centerl Processing Unit(中央处理器)
=^?/+p8k CPU:Center Processing Unit,中央处理器
4pvMd CRC: Cyclical Redundancy Check(循环冗余检查)
hgq;`_;1, CRT(Cathode Ray Tube,阴极射线管)
0=YI@@n) CS(Channel Separation,声道分离)
qE"OB CSE(Configuration Space Enable,可分配空间)
fJg+ Ryo CSS(Common Command Set,通用指令集)
H:|uw CSS: Cascading Style Sheets,层叠格式表
PW0LG^xp` CTO(Chief Technology Officer,首席技术官)
oEv'dQ9 CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
Dd|VMW= CTS(Clear to Send,清除发送)
2^7`mES CVS(Compute Visual Syndrome,计算机视觉综合症)