作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
Hyh$-iCa 3DNow!(3D no waiting)
~M _@_ 3DPA(3D Positional Audio,3D定位音频)
!?#B*JGFS 3DS(3D SubSystem,三维子系统)
@FO=0_;y ABS(Auto Balance System,自动平衡系统)
>cpT_M&C, AC(Audio Codec,音频多媒体数字信号编解码器)
Wl\.*^`k ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
:2ILN.& ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
Bi:%}8STH AE(Atmospheric Effects,雾化效果)
r01Z
0> AFR(Alternate Frame Rendering,交替渲染技术)
pMndyuoJl AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
:qy< G!o AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
<$metN~9j AGU(Address Generation Units,地址产成单元)
vgKZr AH: Authentication Header,鉴定文件头
8A'oK8Q AHA(Accelerated Hub Architecture,加速中心架构)
<A@}C+ AL: Artificial Life(人工生命)
P'l'[Kz{' ALU(Arithmetic Logic Unit,算术逻辑单元)
pL2P
. AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
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y0 AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
YS],o'T Anisotropic Filtering(各向异性过滤)
v'=$K[_ API(Application Programming Interfaces,应用程序接口)
a=@]Ov/ APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
||yx?q6\h APM(Advanced Power Management,高级能源管理)
@$mh0K> APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
&|MdBJ ARP(Address Resolution Protocol,地址解析协议)
GO4IAUA ASC(Anti Static Coatings,防静电涂层)
f"9aL= 3 ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
2zE gAc ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
Z{XF!pS%H ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
.=G?Zd ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
inQ1$ ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
_Fe%Ek1Yy ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
%'o'Kh''= AST(Average Seek time,平均寻道时间)
&"lSq2 ATA(AT Attachment,AT扩展型)
HV2 1=W ATAPI(AT Attachment Packet Interface)
`O,^oD4 ATC(Access Time from Clock,时钟存取时间)
Q%>6u@' ATL: ActiveX Template Library(ActiveX模板库)
U-+o6XX ATM(Asynchronous Transfer Mode,异步传输模式)
D`c&Q4$: ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
T&'p5h=l ATX: AT Extend(扩展型AT)
W?TvdeBx Auxiliary Input(辅助输入接口)
T:/mk`> AV(Analog Video,模拟视频)
12]rfd AVI(Audio Video Interleave,音频视频插入)
kLE("I:7 Back Buffer,后置缓冲
8f`r!/j Backface culling(隐面消除)
Y'
FB
{ BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
#|j8vmfn$e Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
2y`X) BCF(Boot Catalog File,启动目录文件)
xTnFJ$RK2 Benchmarks:基准测试程序数值
_|jEuif BGA(Ball Grid Array,球状矩阵排列)
F%< ZEVm BGA(Ball Grid Array,球状矩阵排列)
WQiIS0BJ * BGA: Ball Grid Array(球状网格阵列)
z"%{SI^ BHT(branch prediction table,分支预测表)
M!tR>NMH BIF(Boot Image File,启动映像文件)
z&wJ"[nOC Bilinear Filtering(双线性过滤)
kY?w] lS)t BIOS(Basic Input/Output System,基本输入/输出系统)
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<P# BLA: Bearn Landing Area(电子束落区)
nixIKOnjC BMC(Black Matrix Screen,超黑矩阵屏幕)
4$oDq BOD(Bandwidth On Demand,弹性带宽运用)
"W^+NeLc BOPS:Billion Operations Per Second,十亿次运算/秒
q:cCk#ra bps(bit per second,位/秒)
y0]"qB BPU(Branch Processing Unit,分支处理单元)
N(J'h$E Brach Pediction(分支预测)
<sTY<i VR BSD(Berkeley Software Distribution,伯克利软件分配代号)
=Jax T90x BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
%`bn=~T^ BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
`T,^os#6 C2C: card-to-card interleaving,卡到卡交错存取
s|vx2-Cu] CAD: computer-aided design,计算机辅助设计
{%Rntb CAM(Common Access Model,公共存取模型)
:JXGgl<y CAS(Column Address Strobe,列地址控制器)
i~"lcgoO CBR(Committed Burst Rate,约定突发速率)
j4wsDtmAU CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
@6kkt~>: CCD(Charge Coupled Device,电荷连接设备)
J?Bj=b CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
(M#m BS CCM(Call Control Manager,拨号控制管理)
:z-?L0C=0 cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
uCHM CCS(Cut Change System)
ku)/
8Z`$ CCT(Clock Cycle Time,时钟周期)
FtW=Cc`hC_ CDR(CD Recordable,可记录光盘)
zI= 9 CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
3!op'X! CDRW(CD-Rewritable,可重复刻录光盘)
K BlJJH`z{ CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
]T=o >% CE(Consumer Electronics,消费电子)
':|E$@$W CEM(cube environment mapping,立方环境映射)
Nd
He:: Center Processing Unit Utilization,中央处理器占用率
#Xk/<It CEO(Chief Executive Officer,首席执行官)
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S'Nm5 CG(Computer Graphics,计算机生成图像)
G%fXHAs .+ CGI(Common Gateway Interface,通用网关接口)
;TKsAU CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
]+5Y\~I CIEA: Commercial Internet Exchange Association,商业因特网交易协会
mtf><YU CIR(Committed Infomation Rate,约定信息速率)
,(B/R8ZF~ CISC(Complex Instruction Set Computing,复杂指令集计算机)
]E|E4K6g CISC(Complex Instruction Set Computing,复杂指令集计算机)
/%F5u}eW CISC: Complex Instruction Set Computing(复杂指令结构)
0.wNa~_G| Clipping(剪贴纹理)
kl|m @Nxp CLK(Clock Cycle,时钟周期)
*SYuq) Clock Synthesizer,时钟合成器
-amNz.`[PR CLV(Constant Linear Velocity,恒定线速度)
m 0]1(\% CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
=d$m@rc0r CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
l!<(}?u9 CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
FwV5{-( COB(Cache on board,板上集成缓存)
yujv^2/ COB(Cache on board,板上集成缓存)
ZEB,Q~ COD(Cache on Die,芯片内集成缓存)
4}t$Lf_ COD(Cache on Die,芯片内集成缓存)
S;SI#Vg@ COM: Component Object Model(组件对象模式)
734H{,~ COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
)_kU,RvZ compressed textures(压缩纹理)
PKZMuEEy, Concurrent Command Engine,协作命令引擎
zG7y$\A COO(Chief Organizer Officer,首席管理官)
"td ,YVK CP: Ceramic Package(陶瓷封装)
Iv{uk$^7S CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
lvG+9e3+ CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
Ow{NI-^K CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
G%dzJpC(
CPS: Certification Practice Statement(使用证明书)
0?''v>% CPU(Center Processing Unit,中央处理器)
Ny$N5/b!! CPU: Centerl Processing Unit(中央处理器)
?s]?2>p CPU:Center Processing Unit,中央处理器
m' eM&1Ba CRC: Cyclical Redundancy Check(循环冗余检查)
#.2} t0*]5 CRT(Cathode Ray Tube,阴极射线管)
!]MGIh#u CS(Channel Separation,声道分离)
g6H` uO CSE(Configuration Space Enable,可分配空间)
eI/@ut}v CSS(Common Command Set,通用指令集)
^qtJcMK+hq CSS: Cascading Style Sheets,层叠格式表
,IPryI CTO(Chief Technology Officer,首席技术官)
nu X`>Oy CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
pYj} CTS(Clear to Send,清除发送)
o;v_vCLO CVS(Compute Visual Syndrome,计算机视觉综合症)