作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
6'\VPjt 3DNow!(3D no waiting)
4\iy{1{E,C 3DPA(3D Positional Audio,3D定位音频)
fk'DJf[M 3DS(3D SubSystem,三维子系统)
IvJ5J&! ABS(Auto Balance System,自动平衡系统)
aB)G!Rm& AC(Audio Codec,音频多媒体数字信号编解码器)
o>MB8[r ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
^y2}C$1V ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
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~k AE(Atmospheric Effects,雾化效果)
9ve)+Lk AFR(Alternate Frame Rendering,交替渲染技术)
&O|qx~( AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
+{[E Ow AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
!DZ4C. AGU(Address Generation Units,地址产成单元)
0*50uK=5 AH: Authentication Header,鉴定文件头
q|S,^0cU AHA(Accelerated Hub Architecture,加速中心架构)
*#c^.4$' AL: Artificial Life(人工生命)
Vh8RVFi;c ALU(Arithmetic Logic Unit,算术逻辑单元)
(k24j*1e$ AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
s,]z6L0 AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
&U{"dJ r Anisotropic Filtering(各向异性过滤)
jGFDj"Y API(Application Programming Interfaces,应用程序接口)
2hFOwI APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
X,ok 3c4X APM(Advanced Power Management,高级能源管理)
>IEc4 APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
i$dF0.}Q ARP(Address Resolution Protocol,地址解析协议)
TM0DR'. ASC(Anti Static Coatings,防静电涂层)
Qvm[2mb ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
+Q&CIo ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
_v +At;Y ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
PLs(+>H ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
Ct pc]lJ} ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
"Tc[1{eI ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
"<1-9CMl AST(Average Seek time,平均寻道时间)
}(v <f*7=n ATA(AT Attachment,AT扩展型)
&WHK|bl ATAPI(AT Attachment Packet Interface)
ge!Asm K ATC(Access Time from Clock,时钟存取时间)
~[`*)(4E ATL: ActiveX Template Library(ActiveX模板库)
Ufv0Xj ATM(Asynchronous Transfer Mode,异步传输模式)
{14sI*b16 ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
7oFA5T _ ATX: AT Extend(扩展型AT)
g33Y]\ Auxiliary Input(辅助输入接口)
}W$}blbp AV(Analog Video,模拟视频)
0]MI*s>& AVI(Audio Video Interleave,音频视频插入)
p5 )+R/ Back Buffer,后置缓冲
D[bPm:\0M Backface culling(隐面消除)
x(bM
BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
_Rey~]iJJ8 Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
of>}fJ_p BCF(Boot Catalog File,启动目录文件)
Ng+Ge5C9 Benchmarks:基准测试程序数值
]]lM) BGA(Ball Grid Array,球状矩阵排列)
#Q$`3rr BGA(Ball Grid Array,球状矩阵排列)
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^e:,{ BGA: Ball Grid Array(球状网格阵列)
eW zyydl BHT(branch prediction table,分支预测表)
Wkc^?0p BIF(Boot Image File,启动映像文件)
.aE%z/@s= Bilinear Filtering(双线性过滤)
OvtiFN^s' BIOS(Basic Input/Output System,基本输入/输出系统)
qwDoYyyu BLA: Bearn Landing Area(电子束落区)
iWMgU:T BMC(Black Matrix Screen,超黑矩阵屏幕)
kG|pM54:^ BOD(Bandwidth On Demand,弹性带宽运用)
31n|ScXv BOPS:Billion Operations Per Second,十亿次运算/秒
6 jo+i[h bps(bit per second,位/秒)
QE%|8UFY BPU(Branch Processing Unit,分支处理单元)
C!J6"j Brach Pediction(分支预测)
Cd51.Sk(l BSD(Berkeley Software Distribution,伯克利软件分配代号)
j aq/]I7 BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
|,OTGZgc BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
{GM8}M~D& C2C: card-to-card interleaving,卡到卡交错存取
`8N],X CAD: computer-aided design,计算机辅助设计
Trwk9 + CAM(Common Access Model,公共存取模型)
7COJ.rA CAS(Column Address Strobe,列地址控制器)
TLiA>`r= CBR(Committed Burst Rate,约定突发速率)
7z4u?>pne* CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
O4w:BWVsn CCD(Charge Coupled Device,电荷连接设备)
DC8,ns]!y CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
5N4[hQrVJ CCM(Call Control Manager,拨号控制管理)
6mbHfL>cO cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
.3*VkAs CCS(Cut Change System)
kFF)6z:2 CCT(Clock Cycle Time,时钟周期)
>!|(n@ CDR(CD Recordable,可记录光盘)
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w CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
=D6H?K-k! CDRW(CD-Rewritable,可重复刻录光盘)
O`W&`B(*k CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
W mT(>JBO CE(Consumer Electronics,消费电子)
Z`lCS
o; CEM(cube environment mapping,立方环境映射)
;Z(~;D Center Processing Unit Utilization,中央处理器占用率
fG\]&LFBU CEO(Chief Executive Officer,首席执行官)
0kB!EJ<OdG CG(Computer Graphics,计算机生成图像)
V`z2F'vT CGI(Common Gateway Interface,通用网关接口)
6X.lncE@p CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
>o"3:/3 CIEA: Commercial Internet Exchange Association,商业因特网交易协会
34P5[j!h CIR(Committed Infomation Rate,约定信息速率)
qg;fh]j% CISC(Complex Instruction Set Computing,复杂指令集计算机)
RU^lR8; CISC(Complex Instruction Set Computing,复杂指令集计算机)
"x$RTuWA9 CISC: Complex Instruction Set Computing(复杂指令结构)
]Ak@!&hyak Clipping(剪贴纹理)
(iZE}qf7g CLK(Clock Cycle,时钟周期)
#Ua+P(1q Clock Synthesizer,时钟合成器
H21\6 GY CLV(Constant Linear Velocity,恒定线速度)
,3{z_Rax- CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
&i~AXNw CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
Nl^{w'X0h CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
ToHCS/J59 COB(Cache on board,板上集成缓存)
= ?hx+-' COB(Cache on board,板上集成缓存)
G;%Pf9o26 COD(Cache on Die,芯片内集成缓存)
S6sw) COD(Cache on Die,芯片内集成缓存)
c=T^)~$$ COM: Component Object Model(组件对象模式)
)A4WK+yD$z COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
3 TN?yP) compressed textures(压缩纹理)
hC.7Z] Concurrent Command Engine,协作命令引擎
%q@eCN COO(Chief Organizer Officer,首席管理官)
?wR;" CP: Ceramic Package(陶瓷封装)
Zbp ByRyN CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
|WB<yA1 CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
'`Smg3T!~S CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
Lw]:/x CPS: Certification Practice Statement(使用证明书)
2b]'KiX CPU(Center Processing Unit,中央处理器)
Hiz e
m! CPU: Centerl Processing Unit(中央处理器)
!j)H!|R CPU:Center Processing Unit,中央处理器
o4b!U % CRC: Cyclical Redundancy Check(循环冗余检查)
]8q5k5~ CRT(Cathode Ray Tube,阴极射线管)
/AR;O4X+ CS(Channel Separation,声道分离)
=$g8"[4 CSE(Configuration Space Enable,可分配空间)
8E /]k\ CSS(Common Command Set,通用指令集)
]rDf3_!m( CSS: Cascading Style Sheets,层叠格式表
@$~ BU;kR CTO(Chief Technology Officer,首席技术官)
^ZFbp@#U CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
daaEN( CTS(Clear to Send,清除发送)
Jr18faEZw CVS(Compute Visual Syndrome,计算机视觉综合症)