作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
M`xI N~ 3DNow!(3D no waiting)
<)o xs]< 3DPA(3D Positional Audio,3D定位音频)
id]}10 3DS(3D SubSystem,三维子系统)
:)Da^V ABS(Auto Balance System,自动平衡系统)
x[$:^5V AC(Audio Codec,音频多媒体数字信号编解码器)
A[f`xE ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
N5b&tJbM0 ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
?S.LGc AE(Atmospheric Effects,雾化效果)
2(R{3E4. AFR(Alternate Frame Rendering,交替渲染技术)
-#g0 AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
~}Z{hs) AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
fLV@~T| AGU(Address Generation Units,地址产成单元)
~u r}6T AH: Authentication Header,鉴定文件头
5e2yJ R AHA(Accelerated Hub Architecture,加速中心架构)
|xpOU*k AL: Artificial Life(人工生命)
s+v$sF ALU(Arithmetic Logic Unit,算术逻辑单元)
+\J+?jOC4S AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
#:Ukv? AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
!@>:k3DC& Anisotropic Filtering(各向异性过滤)
T? ,Q=. API(Application Programming Interfaces,应用程序接口)
\]Rmq_O APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
EDg; s-T= APM(Advanced Power Management,高级能源管理)
!ce,^z&5 APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
Qk&6Z% ARP(Address Resolution Protocol,地址解析协议)
=BzBM`-o ASC(Anti Static Coatings,防静电涂层)
7s;*vd> ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
u#0EZ2># ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
&cf_?4 ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
A$TFa:O| ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
;\iu*1>Z,& ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
^{-Z3Yxd ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
2-:` lrVd AST(Average Seek time,平均寻道时间)
DMT2~mh ATA(AT Attachment,AT扩展型)
M2nZ,I=l ATAPI(AT Attachment Packet Interface)
C(}Kfi@6N ATC(Access Time from Clock,时钟存取时间)
lsVg'k/Z! ATL: ActiveX Template Library(ActiveX模板库)
~P9^4 ATM(Asynchronous Transfer Mode,异步传输模式)
u)l[*";S ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
R#/0}+-M ATX: AT Extend(扩展型AT)
sA+( |cEh Auxiliary Input(辅助输入接口)
&lW~ot1, AV(Analog Video,模拟视频)
['I5(M@ AVI(Audio Video Interleave,音频视频插入)
dV"Kx Back Buffer,后置缓冲
!XY}\zKq Backface culling(隐面消除)
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!WFY BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
u6*mHkM Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
;zi4W1 BCF(Boot Catalog File,启动目录文件)
a<Ps6' Benchmarks:基准测试程序数值
m_UzmWF BGA(Ball Grid Array,球状矩阵排列)
`_M&zN BGA(Ball Grid Array,球状矩阵排列)
r
D|Bj(X8 BGA: Ball Grid Array(球状网格阵列)
Y IVN;:B. BHT(branch prediction table,分支预测表)
QC+BEN$ BIF(Boot Image File,启动映像文件)
}do=lm?/ Bilinear Filtering(双线性过滤)
s?&UFyYb, BIOS(Basic Input/Output System,基本输入/输出系统)
{-s7_\|p( BLA: Bearn Landing Area(电子束落区)
ra{HlB{ BMC(Black Matrix Screen,超黑矩阵屏幕)
!^w}Sp BOD(Bandwidth On Demand,弹性带宽运用)
xQ8?"K;iX BOPS:Billion Operations Per Second,十亿次运算/秒
HuajdC~ bps(bit per second,位/秒)
0EUC8Ni BPU(Branch Processing Unit,分支处理单元)
T?8N$J Brach Pediction(分支预测)
m# I BSD(Berkeley Software Distribution,伯克利软件分配代号)
>\ PNKpn{ BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
AO0aOX8_+D BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
zA&]#mc C2C: card-to-card interleaving,卡到卡交错存取
Fx@@.O6 CAD: computer-aided design,计算机辅助设计
$-_@MT~ CAM(Common Access Model,公共存取模型)
}U$p[Gi< CAS(Column Address Strobe,列地址控制器)
*iujJi CBR(Committed Burst Rate,约定突发速率)
19^B610 CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
W$u/tRF CCD(Charge Coupled Device,电荷连接设备)
~H`(z zk CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
c +]5[6 CCM(Call Control Manager,拨号控制管理)
Rm=[Sj84 cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
l1}HJmom CCS(Cut Change System)
,F0bkNBG CCT(Clock Cycle Time,时钟周期)
8f-B-e?k CDR(CD Recordable,可记录光盘)
yyuf CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
Rs1JCP=d8 CDRW(CD-Rewritable,可重复刻录光盘)
qvN 5[rb CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
`Z~\&r= CE(Consumer Electronics,消费电子)
GZNfx8zsY+ CEM(cube environment mapping,立方环境映射)
w_^g-P[o- Center Processing Unit Utilization,中央处理器占用率
FLOSdMYdw CEO(Chief Executive Officer,首席执行官)
v/}hy$7 CG(Computer Graphics,计算机生成图像)
T\$r| CGI(Common Gateway Interface,通用网关接口)
|%7OI#t^ CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
DX@*lM CIEA: Commercial Internet Exchange Association,商业因特网交易协会
EyPF'|Qtn CIR(Committed Infomation Rate,约定信息速率)
:X~{,J CISC(Complex Instruction Set Computing,复杂指令集计算机)
.g95E<bd CISC(Complex Instruction Set Computing,复杂指令集计算机)
hS:j$je CISC: Complex Instruction Set Computing(复杂指令结构)
X4:SH>U! Clipping(剪贴纹理)
*heX[D
&>) CLK(Clock Cycle,时钟周期)
ttC+`0+H Clock Synthesizer,时钟合成器
nV+]jQ~o CLV(Constant Linear Velocity,恒定线速度)
Zk75GC CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
P
:D6w){ CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
IBe0?F # CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
L#NW<T COB(Cache on board,板上集成缓存)
dEM=U; COB(Cache on board,板上集成缓存)
U4$CkTe2Y COD(Cache on Die,芯片内集成缓存)
i2+vUl|;Z COD(Cache on Die,芯片内集成缓存)
k=qb YGK COM: Component Object Model(组件对象模式)
V61.UEN COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
7Yd]#K{$ compressed textures(压缩纹理)
E;C=V2#>[ Concurrent Command Engine,协作命令引擎
[P?.(* COO(Chief Organizer Officer,首席管理官)
^\zf8kPti CP: Ceramic Package(陶瓷封装)
!^<%RT9@| CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
dk4|*l- CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
[EU\- CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
EkE U}2 CPS: Certification Practice Statement(使用证明书)
{!rpE7P- CPU(Center Processing Unit,中央处理器)
orzy&4 CPU: Centerl Processing Unit(中央处理器)
Y>: e4Q CPU:Center Processing Unit,中央处理器
6t(I.>- CRC: Cyclical Redundancy Check(循环冗余检查)
ON/U0V:v CRT(Cathode Ray Tube,阴极射线管)
4P\?vz" CS(Channel Separation,声道分离)
wX*F'r"z CSE(Configuration Space Enable,可分配空间)
{]CO;5: CSS(Common Command Set,通用指令集)
b#[7A CSS: Cascading Style Sheets,层叠格式表
V}UYr Va#9 CTO(Chief Technology Officer,首席技术官)
nofK(0TF CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
|ydOi& CTS(Clear to Send,清除发送)
Ue22,Pp6 CVS(Compute Visual Syndrome,计算机视觉综合症)