作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
A!a.,{fZ 3DNow!(3D no waiting)
hh-sm8 3DPA(3D Positional Audio,3D定位音频)
"[CR5q9Pr 3DS(3D SubSystem,三维子系统)
[`1@`5SL- ABS(Auto Balance System,自动平衡系统)
eX'V#K#C AC(Audio Codec,音频多媒体数字信号编解码器)
y!~ }7= ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
2Xv$ ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
~vMJ?P@ AE(Atmospheric Effects,雾化效果)
0 l+Jq AFR(Alternate Frame Rendering,交替渲染技术)
H)X&5E AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
]'0}fuV AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
w%%*3[--X AGU(Address Generation Units,地址产成单元)
1CS\1[E AH: Authentication Header,鉴定文件头
w|-m*v
. AHA(Accelerated Hub Architecture,加速中心架构)
2
yRUw AL: Artificial Life(人工生命)
j!IkU}*c ALU(Arithmetic Logic Unit,算术逻辑单元)
M|UCV_omN AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
-E.fo._L5 AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
HzAw
rC Anisotropic Filtering(各向异性过滤)
3O|2Z~>3 API(Application Programming Interfaces,应用程序接口)
V" KuwM APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
VP1z"j: APM(Advanced Power Management,高级能源管理)
WFvVu3 APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
bMqFrG ARP(Address Resolution Protocol,地址解析协议)
zuJ@@\75 ASC(Anti Static Coatings,防静电涂层)
tSVS ogGd ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
z#6(PZC} ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
zw0u|q;# ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
.cr<.Ov ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
pwA~?$B1 ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
9r 5( ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
bj@f<f` AST(Average Seek time,平均寻道时间)
;S'1fci6 ATA(AT Attachment,AT扩展型)
{v2[x W ATAPI(AT Attachment Packet Interface)
E=ObfN"ge ATC(Access Time from Clock,时钟存取时间)
D_BdvWSxj ATL: ActiveX Template Library(ActiveX模板库)
/#[mV(k ATM(Asynchronous Transfer Mode,异步传输模式)
)k81 ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
KBgFS%-W ATX: AT Extend(扩展型AT)
D4T(Dce Auxiliary Input(辅助输入接口)
|W5lhx0U AV(Analog Video,模拟视频)
Tz7|OV_W$ AVI(Audio Video Interleave,音频视频插入)
USKC,&6&} Back Buffer,后置缓冲
<'~6L#>,< Backface culling(隐面消除)
VL$?vI' BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
%<MI]D Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
UryHte BCF(Boot Catalog File,启动目录文件)
Qa"4^s Benchmarks:基准测试程序数值
4XSq\.@G BGA(Ball Grid Array,球状矩阵排列)
}&^1")2t BGA(Ball Grid Array,球状矩阵排列)
Mz;KXP BGA: Ball Grid Array(球状网格阵列)
>KJE *X@s BHT(branch prediction table,分支预测表)
b:$q5 BIF(Boot Image File,启动映像文件)
&Zo+F]3d Bilinear Filtering(双线性过滤)
b6@0?_n BIOS(Basic Input/Output System,基本输入/输出系统)
,8stEp9~h] BLA: Bearn Landing Area(电子束落区)
{&nDm$KTD BMC(Black Matrix Screen,超黑矩阵屏幕)
5IbCE.>iU BOD(Bandwidth On Demand,弹性带宽运用)
Cjj(v7[E BOPS:Billion Operations Per Second,十亿次运算/秒
-5@hU8B'a bps(bit per second,位/秒)
rfV{+^T; BPU(Branch Processing Unit,分支处理单元)
xo{z4W Brach Pediction(分支预测)
=P,pW BSD(Berkeley Software Distribution,伯克利软件分配代号)
/pJr%}sc BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
jV#1d8qm BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
4\ny]A:~ C2C: card-to-card interleaving,卡到卡交错存取
M%5_~g2n'\ CAD: computer-aided design,计算机辅助设计
r|ogF8YN CAM(Common Access Model,公共存取模型)
y_T%xWK5 CAS(Column Address Strobe,列地址控制器)
9+~1# | CBR(Committed Burst Rate,约定突发速率)
n%6=w9.%c CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
n`p/;D=? CCD(Charge Coupled Device,电荷连接设备)
wYh]3 CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
3(1UIu CCM(Call Control Manager,拨号控制管理)
J,k.*t: cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
#_zj5B38E CCS(Cut Change System)
!ozHS_ CCT(Clock Cycle Time,时钟周期)
e?; CDR(CD Recordable,可记录光盘)
y4Nam87;/? CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
3Q_)Xs
r` CDRW(CD-Rewritable,可重复刻录光盘)
h#uk-7 CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
H h%|}*f_, CE(Consumer Electronics,消费电子)
[V0%=q+ R CEM(cube environment mapping,立方环境映射)
_;:B@Z Center Processing Unit Utilization,中央处理器占用率
q[c^`5 CEO(Chief Executive Officer,首席执行官)
DK#Tr: 7 CG(Computer Graphics,计算机生成图像)
vH6.;j'^ CGI(Common Gateway Interface,通用网关接口)
;z~j%L%b CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
}L>0}H CIEA: Commercial Internet Exchange Association,商业因特网交易协会
-c%'f&P CIR(Committed Infomation Rate,约定信息速率)
vh^?M#\ CISC(Complex Instruction Set Computing,复杂指令集计算机)
kM3#[#6$! CISC(Complex Instruction Set Computing,复杂指令集计算机)
>vNE3S_ CISC: Complex Instruction Set Computing(复杂指令结构)
K^%ONultv Clipping(剪贴纹理)
J?f7!F:8 CLK(Clock Cycle,时钟周期)
//yz$d>JN Clock Synthesizer,时钟合成器
au/5` CLV(Constant Linear Velocity,恒定线速度)
i \@a&tw CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
\sS0@gnDI CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
Q=^TKsu CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
`=2p6<#z COB(Cache on board,板上集成缓存)
*Q;?p
hr COB(Cache on board,板上集成缓存)
Y\E7nll:. COD(Cache on Die,芯片内集成缓存)
~FnY'F<35 COD(Cache on Die,芯片内集成缓存)
;V84Dy#b COM: Component Object Model(组件对象模式)
e,l-}=5*P COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
i_p-|I:hQ compressed textures(压缩纹理)
a!,X@5 Concurrent Command Engine,协作命令引擎
G1wJ]ar COO(Chief Organizer Officer,首席管理官)
7~VDk5Z6 CP: Ceramic Package(陶瓷封装)
m5cRHo<9Y CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
n"nfEA3{` CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
"FLiSz%ME CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
K/8TwB?I CPS: Certification Practice Statement(使用证明书)
4 Z&KR<2Z CPU(Center Processing Unit,中央处理器)
seZb;0 CPU: Centerl Processing Unit(中央处理器)
^_uCSA'X CPU:Center Processing Unit,中央处理器
E*QLw*H CRC: Cyclical Redundancy Check(循环冗余检查)
;+lsNf CRT(Cathode Ray Tube,阴极射线管)
VBK |*Tl CS(Channel Separation,声道分离)
yER CSE(Configuration Space Enable,可分配空间)
Eopb##o CSS(Common Command Set,通用指令集)
Nu+DVIM CSS: Cascading Style Sheets,层叠格式表
z]!w@: CTO(Chief Technology Officer,首席技术官)
i ~rb-~o CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
Am#Pa,g CTS(Clear to Send,清除发送)
dHtEyF CVS(Compute Visual Syndrome,计算机视觉综合症)