作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
/t?(IcP5 3DNow!(3D no waiting)
or]s 3DPA(3D Positional Audio,3D定位音频)
on1mu't_; 3DS(3D SubSystem,三维子系统)
4HDQj]z/ ABS(Auto Balance System,自动平衡系统)
dzMI5fA<_ AC(Audio Codec,音频多媒体数字信号编解码器)
4^B:Q9B) ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
B6vmBmN ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
';7|H|,F AE(Atmospheric Effects,雾化效果)
8 _[f#s`) AFR(Alternate Frame Rendering,交替渲染技术)
Qod2m$>wp} AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
>Y/1%Hp9 AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
FJ&zU<E AGU(Address Generation Units,地址产成单元)
("BFI AH: Authentication Header,鉴定文件头
x]U (EX`t$ AHA(Accelerated Hub Architecture,加速中心架构)
kLqFh< AL: Artificial Life(人工生命)
Ljxn}):[ ALU(Arithmetic Logic Unit,算术逻辑单元)
Sq==)$G AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
HM1y$ej AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
yQ8H-a. Anisotropic Filtering(各向异性过滤)
k
.l,>s`! API(Application Programming Interfaces,应用程序接口)
@.iOFY APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
>heih%Ar0J APM(Advanced Power Management,高级能源管理)
z*>CP APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
cWM|COXL+ ARP(Address Resolution Protocol,地址解析协议)
I@q>ES!1H ASC(Anti Static Coatings,防静电涂层)
g^En6n) ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
aa1XY&G"! ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
;7<a0HZ5! ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
j|(bDa4\ ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
ArU>./)Q ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
BmUzsfD ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
Xc5[d`] AST(Average Seek time,平均寻道时间)
:<IW' ATA(AT Attachment,AT扩展型)
ikRIL2Y ATAPI(AT Attachment Packet Interface)
|,&!Q$<un ATC(Access Time from Clock,时钟存取时间)
RN:#+S(8 ATL: ActiveX Template Library(ActiveX模板库)
*id|za|:k ATM(Asynchronous Transfer Mode,异步传输模式)
{UZli[W1 ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
(^Do#3 ATX: AT Extend(扩展型AT)
0QIocha Auxiliary Input(辅助输入接口)
emS +%6U AV(Analog Video,模拟视频)
k*c:%vC! AVI(Audio Video Interleave,音频视频插入)
[I4FU7mpH Back Buffer,后置缓冲
MgMLfgt"V Backface culling(隐面消除)
7<^D7 BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
KwQO,($,] Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
)SUN+YV^ BCF(Boot Catalog File,启动目录文件)
Q84KU8?d Benchmarks:基准测试程序数值
W{m0z+N[B BGA(Ball Grid Array,球状矩阵排列)
N<> dg BGA(Ball Grid Array,球状矩阵排列)
_zmx BGA: Ball Grid Array(球状网格阵列)
d8RpL{9\7 BHT(branch prediction table,分支预测表)
p
go\(K0 BIF(Boot Image File,启动映像文件)
8rp-XiW Bilinear Filtering(双线性过滤)
= xX^ BIOS(Basic Input/Output System,基本输入/输出系统)
BK d( BLA: Bearn Landing Area(电子束落区)
)Y&De)= BMC(Black Matrix Screen,超黑矩阵屏幕)
EJtU(HmW BOD(Bandwidth On Demand,弹性带宽运用)
Z#MODf0H@ BOPS:Billion Operations Per Second,十亿次运算/秒
'HcDl@E bps(bit per second,位/秒)
5!ReW39c; BPU(Branch Processing Unit,分支处理单元)
/?XfVhA:A Brach Pediction(分支预测)
=OZ_\vO BSD(Berkeley Software Distribution,伯克利软件分配代号)
C${TC+z BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
r&3fSx9 BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
2aje$w- C2C: card-to-card interleaving,卡到卡交错存取
i)(QNpv CAD: computer-aided design,计算机辅助设计
ycAQPz}=I CAM(Common Access Model,公共存取模型)
'qd") CAS(Column Address Strobe,列地址控制器)
S8)awTA9 CBR(Committed Burst Rate,约定突发速率)
B-gr2- CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
3MzY]J
y( CCD(Charge Coupled Device,电荷连接设备)
M7>\Qk CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
iRVLo~ CCM(Call Control Manager,拨号控制管理)
%-'U9e KN cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
6HqK%( CCS(Cut Change System)
YYvs~?bAy CCT(Clock Cycle Time,时钟周期)
6Rf5 CDR(CD Recordable,可记录光盘)
oV!9B -< CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
5~"=Fm<uD CDRW(CD-Rewritable,可重复刻录光盘)
zm .2L CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
)w`Nkx CE(Consumer Electronics,消费电子)
3 z#;0n} CEM(cube environment mapping,立方环境映射)
u ?Xku8 1l Center Processing Unit Utilization,中央处理器占用率
zn~m;0Xi CEO(Chief Executive Officer,首席执行官)
v1lj /A CG(Computer Graphics,计算机生成图像)
P%lLKSA CGI(Common Gateway Interface,通用网关接口)
&^7)yS+C CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
/&dt!.WY^ CIEA: Commercial Internet Exchange Association,商业因特网交易协会
<C{5(=X{ CIR(Committed Infomation Rate,约定信息速率)
_/=ZkI5 CISC(Complex Instruction Set Computing,复杂指令集计算机)
N_DgnZ7* CISC(Complex Instruction Set Computing,复杂指令集计算机)
7f$Lb,\y CISC: Complex Instruction Set Computing(复杂指令结构)
5~X%*_[], Clipping(剪贴纹理)
d#tUG~jc CLK(Clock Cycle,时钟周期)
M:SxAo-D2 Clock Synthesizer,时钟合成器
'} kq@ CLV(Constant Linear Velocity,恒定线速度)
;i#gk%-
2 CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
^,5.vfES CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
^9RBG#ud CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
g0U
?s COB(Cache on board,板上集成缓存)
z} \9/` COB(Cache on board,板上集成缓存)
rN~`4mZ COD(Cache on Die,芯片内集成缓存)
By_Ui6:D COD(Cache on Die,芯片内集成缓存)
e.GzGX COM: Component Object Model(组件对象模式)
D?'y)]( COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
h5gXYmk compressed textures(压缩纹理)
9$ S,P| Concurrent Command Engine,协作命令引擎
j&pgq2Kl COO(Chief Organizer Officer,首席管理官)
.2P?1HpK CP: Ceramic Package(陶瓷封装)
6J*`<k/S CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
Y"jDZG? CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
aS7zG2R4H CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
GT.^u#r CPS: Certification Practice Statement(使用证明书)
}a1UOScO0 CPU(Center Processing Unit,中央处理器)
1m)/_y~1
k CPU: Centerl Processing Unit(中央处理器)
WI,=?~- CPU:Center Processing Unit,中央处理器
80EY7#r@w CRC: Cyclical Redundancy Check(循环冗余检查)
l!=WqIZ CRT(Cathode Ray Tube,阴极射线管)
;R!H\ CS(Channel Separation,声道分离)
`IoX'|C[h CSE(Configuration Space Enable,可分配空间)
zef,*dQY CSS(Common Command Set,通用指令集)
&B4U) CSS: Cascading Style Sheets,层叠格式表
w3Ohm7N[ CTO(Chief Technology Officer,首席技术官)
]>L]?Rm CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
K5lp-F CTS(Clear to Send,清除发送)
F%d"gF0qu CVS(Compute Visual Syndrome,计算机视觉综合症)