作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
=z<sx2#* 3DNow!(3D no waiting)
yDe*-N\'W 3DPA(3D Positional Audio,3D定位音频)
"]'W^Fg 3DS(3D SubSystem,三维子系统)
tBwPB#:W ABS(Auto Balance System,自动平衡系统)
n[v`F AC(Audio Codec,音频多媒体数字信号编解码器)
JlE+CAny ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
[Q6$$z92Q ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
7~P!Z=m^^f AE(Atmospheric Effects,雾化效果)
zH~g5xgh AFR(Alternate Frame Rendering,交替渲染技术)
Aq(, AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
6"rS?>W/mO AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
LS#_K- AGU(Address Generation Units,地址产成单元)
#L*MMC" AH: Authentication Header,鉴定文件头
[5M! ' AHA(Accelerated Hub Architecture,加速中心架构)
VzcW9'"# AL: Artificial Life(人工生命)
/z)8k4 ALU(Arithmetic Logic Unit,算术逻辑单元)
,g|ht%" AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
eUgKwu; AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
%\B?X;( Anisotropic Filtering(各向异性过滤)
6/(Z*L"~6k API(Application Programming Interfaces,应用程序接口)
<3=k APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
>%_i#|dE> APM(Advanced Power Management,高级能源管理)
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`~J APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
,s@S`KS0 ARP(Address Resolution Protocol,地址解析协议)
chE}`I? ASC(Anti Static Coatings,防静电涂层)
P;&U3i ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
NX]6RZr- ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
(15.?9 ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
3rX8H`R ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
`@:k*d ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
,S, R6#3G ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
V|nJ%G\ AST(Average Seek time,平均寻道时间)
xFp9H'j{ ATA(AT Attachment,AT扩展型)
"68=dC ATAPI(AT Attachment Packet Interface)
A/j'{X!z
ATC(Access Time from Clock,时钟存取时间)
,p..h+l ATL: ActiveX Template Library(ActiveX模板库)
O7,:-5h0 ATM(Asynchronous Transfer Mode,异步传输模式)
?DNeL;6 ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
&,]yqG 2 ATX: AT Extend(扩展型AT)
Aj> Auxiliary Input(辅助输入接口)
)hK;27m4 AV(Analog Video,模拟视频)
UC00zW<Z@" AVI(Audio Video Interleave,音频视频插入)
H
a`V"X{} Back Buffer,后置缓冲
f-}_ Backface culling(隐面消除)
>Y:veEa6v6 BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
(1Jc-` Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
KDDx[]1Q BCF(Boot Catalog File,启动目录文件)
0=OvVU;P Benchmarks:基准测试程序数值
Ftud6 BGA(Ball Grid Array,球状矩阵排列)
o 7 &q BGA(Ball Grid Array,球状矩阵排列)
f_QZql BGA: Ball Grid Array(球状网格阵列)
HNfd[#gV BHT(branch prediction table,分支预测表)
J'lqHf$T BIF(Boot Image File,启动映像文件)
HuD~(CI. Bilinear Filtering(双线性过滤)
*NIhYg6 BIOS(Basic Input/Output System,基本输入/输出系统)
5*$z4O:Aa BLA: Bearn Landing Area(电子束落区)
[{+ZQd BMC(Black Matrix Screen,超黑矩阵屏幕)
#Z_f/@b BOD(Bandwidth On Demand,弹性带宽运用)
ADA*w 1 BOPS:Billion Operations Per Second,十亿次运算/秒
|q_Hiap#a bps(bit per second,位/秒)
m W4tW BPU(Branch Processing Unit,分支处理单元)
6~8dMy;w Brach Pediction(分支预测)
k~$}&O BSD(Berkeley Software Distribution,伯克利软件分配代号)
}iB>3|\ BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
Z2k5qs7g BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
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B+Pl6l)F C2C: card-to-card interleaving,卡到卡交错存取
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LBW# CAD: computer-aided design,计算机辅助设计
-9"[/ CAM(Common Access Model,公共存取模型)
(i^<er q CAS(Column Address Strobe,列地址控制器)
k,[[
CZ0j CBR(Committed Burst Rate,约定突发速率)
FWyfFCK CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
Vvl8P|x.< CCD(Charge Coupled Device,电荷连接设备)
FzFP 0 CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
gAy"W$F CCM(Call Control Manager,拨号控制管理)
28xLaob cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
3W?H^1t CCS(Cut Change System)
BOW`{= CCT(Clock Cycle Time,时钟周期)
QPsvc6ds CDR(CD Recordable,可记录光盘)
|\q@XCGei CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
+r__>V, CDRW(CD-Rewritable,可重复刻录光盘)
8d\/ CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
3#c0p790 CE(Consumer Electronics,消费电子)
G/}nwj\ CEM(cube environment mapping,立方环境映射)
Jb`yK@x Center Processing Unit Utilization,中央处理器占用率
Kdd5ysTQ CEO(Chief Executive Officer,首席执行官)
(0bXsfe CG(Computer Graphics,计算机生成图像)
s!K9-qZl< CGI(Common Gateway Interface,通用网关接口)
3=kw{r[2lM CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
uB3Yl=P CIEA: Commercial Internet Exchange Association,商业因特网交易协会
VaylbYUCT/ CIR(Committed Infomation Rate,约定信息速率)
@?<1~/sfL CISC(Complex Instruction Set Computing,复杂指令集计算机)
o7s<G8;? CISC(Complex Instruction Set Computing,复杂指令集计算机)
<o&\/uO~H CISC: Complex Instruction Set Computing(复杂指令结构)
qu0dWgK Clipping(剪贴纹理)
se]QEd7]7 CLK(Clock Cycle,时钟周期)
*Y9' tHI Clock Synthesizer,时钟合成器
>U'gQS?\] CLV(Constant Linear Velocity,恒定线速度)
[%BWCd8Q~P CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
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CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
Yu9.0A_) : CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
$8Y|&P COB(Cache on board,板上集成缓存)
wg 6 COB(Cache on board,板上集成缓存)
_,]@xFCOH COD(Cache on Die,芯片内集成缓存)
G[[<-[C]5 COD(Cache on Die,芯片内集成缓存)
Fpf-Fa-K\b COM: Component Object Model(组件对象模式)
:jioF{, COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
8AVG pL compressed textures(压缩纹理)
+^@6{1 Concurrent Command Engine,协作命令引擎
iQ_^MzA COO(Chief Organizer Officer,首席管理官)
Fo[=Dh*AqU CP: Ceramic Package(陶瓷封装)
A**PGy.Ni CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
F6 c1YI[ CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
&IgH]?t CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
\KPwh]0 CPS: Certification Practice Statement(使用证明书)
9q
f=P3 CPU(Center Processing Unit,中央处理器)
*%`jcF CPU: Centerl Processing Unit(中央处理器)
QF`o%mI CPU:Center Processing Unit,中央处理器
14;lB.$p CRC: Cyclical Redundancy Check(循环冗余检查)
Z:s:NvFX CRT(Cathode Ray Tube,阴极射线管)
#R$[?fW CS(Channel Separation,声道分离)
hO}nc$S CSE(Configuration Space Enable,可分配空间)
2w? 5vSv CSS(Common Command Set,通用指令集)
/0I=?+QSo CSS: Cascading Style Sheets,层叠格式表
I &I
q CTO(Chief Technology Officer,首席技术官)
ac??lHtH9 CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
8|iMD1 CTS(Clear to Send,清除发送)
1$G'Kg/ CVS(Compute Visual Syndrome,计算机视觉综合症)