作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
uNXh"? 3DNow!(3D no waiting)
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YUIpe 3DPA(3D Positional Audio,3D定位音频)
.NjdkHYR 3DS(3D SubSystem,三维子系统)
1b3Lan_2 ABS(Auto Balance System,自动平衡系统)
+Q-~~v7, AC(Audio Codec,音频多媒体数字信号编解码器)
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ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
EUuMSDp ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
'4Z%{.; AE(Atmospheric Effects,雾化效果)
f+xGf6V AFR(Alternate Frame Rendering,交替渲染技术)
e@]cI/j AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
oE)c8rE AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
oK5(,8
(4 AGU(Address Generation Units,地址产成单元)
8GlH)J+kq AH: Authentication Header,鉴定文件头
Rz=]KeZu AHA(Accelerated Hub Architecture,加速中心架构)
|w~zh6~ AL: Artificial Life(人工生命)
rLL;NTN+/ ALU(Arithmetic Logic Unit,算术逻辑单元)
]v_xEH}T AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
MW*}+ PCY AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
iXl1S[.l Anisotropic Filtering(各向异性过滤)
DA@
{ d-A API(Application Programming Interfaces,应用程序接口)
[&3"kb APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
NlcWnSv APM(Advanced Power Management,高级能源管理)
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^ APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
;o^m"I\y ARP(Address Resolution Protocol,地址解析协议)
G#@<bg3 ASC(Anti Static Coatings,防静电涂层)
;k/0N~ ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
P\zi:]h[Gh ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
n+uq|sYVa ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
_IlL'c5 ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
(OG@]|- ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
/-|xxy ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
$ @1&G~x AST(Average Seek time,平均寻道时间)
`SW`d<+L ATA(AT Attachment,AT扩展型)
eHnC^W}|s ATAPI(AT Attachment Packet Interface)
82/iVm1 ATC(Access Time from Clock,时钟存取时间)
K=(&iq!VO ATL: ActiveX Template Library(ActiveX模板库)
} |SVt`n ATM(Asynchronous Transfer Mode,异步传输模式)
J.?p?-" ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
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\$ ATX: AT Extend(扩展型AT)
}f-rWe{gs> Auxiliary Input(辅助输入接口)
IL%&*B AV(Analog Video,模拟视频)
W2^eE9 AVI(Audio Video Interleave,音频视频插入)
aO<d`DTyJ Back Buffer,后置缓冲
nAts.pVy" Backface culling(隐面消除)
V|a59[y? BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
9h0|^ttF Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
> %Y#(_~a BCF(Boot Catalog File,启动目录文件)
nQ~q-=,L Benchmarks:基准测试程序数值
uwQ4RYz BGA(Ball Grid Array,球状矩阵排列)
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BGA(Ball Grid Array,球状矩阵排列)
D1g1"^~g BGA: Ball Grid Array(球状网格阵列)
/ TJTu_# BHT(branch prediction table,分支预测表)
\'p7,F{:>5 BIF(Boot Image File,启动映像文件)
T2(+HI2 Bilinear Filtering(双线性过滤)
]iNSa{G BIOS(Basic Input/Output System,基本输入/输出系统)
v#/,,)m BLA: Bearn Landing Area(电子束落区)
uPo>?hpq+ BMC(Black Matrix Screen,超黑矩阵屏幕)
n--`zx-[' BOD(Bandwidth On Demand,弹性带宽运用)
RgRcW5VxK BOPS:Billion Operations Per Second,十亿次运算/秒
3t_5Xacj bps(bit per second,位/秒)
X*Q7Yu BPU(Branch Processing Unit,分支处理单元)
w^p2XlQ< Brach Pediction(分支预测)
}Ql;% 7 BSD(Berkeley Software Distribution,伯克利软件分配代号)
Ahwu'mgnC BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
Tf[]vqa`G BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
A6U6SvM; C2C: card-to-card interleaving,卡到卡交错存取
bg=`
CAD: computer-aided design,计算机辅助设计
;zJ_apZ:{ CAM(Common Access Model,公共存取模型)
ix/uV)]k` CAS(Column Address Strobe,列地址控制器)
UNAuF8>K CBR(Committed Burst Rate,约定突发速率)
kU^@R<Fo CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
&WRoNc CCD(Charge Coupled Device,电荷连接设备)
vcSS+ CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
OB^ CCM(Call Control Manager,拨号控制管理)
~,guw7F cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
Uis
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8/k CCS(Cut Change System)
_j2`#|oG CCT(Clock Cycle Time,时钟周期)
pucHB<R@bL CDR(CD Recordable,可记录光盘)
l3MH+o CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
?nn,RBS- CDRW(CD-Rewritable,可重复刻录光盘)
J *B`C^i CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
_Ey8P0-I CE(Consumer Electronics,消费电子)
bQ4 }no0 CEM(cube environment mapping,立方环境映射)
a&cV@~ Center Processing Unit Utilization,中央处理器占用率
o._^ CEO(Chief Executive Officer,首席执行官)
So 5{E4[ CG(Computer Graphics,计算机生成图像)
c~C W-%wN CGI(Common Gateway Interface,通用网关接口)
UM]wDFn'E CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
a3)#tt=rA CIEA: Commercial Internet Exchange Association,商业因特网交易协会
j>:T)zhyY CIR(Committed Infomation Rate,约定信息速率)
V , "'k<y CISC(Complex Instruction Set Computing,复杂指令集计算机)
GkO6r'MVE CISC(Complex Instruction Set Computing,复杂指令集计算机)
L7b{H2 2 CISC: Complex Instruction Set Computing(复杂指令结构)
BA5= D>T- Clipping(剪贴纹理)
y7Ub~qU CLK(Clock Cycle,时钟周期)
Xg)yz~Ug Clock Synthesizer,时钟合成器
}B.C#Y$@ CLV(Constant Linear Velocity,恒定线速度)
j)0R*_-B[ CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
2U+&F'&Q CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
0jS/U|0 CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
3_>1j COB(Cache on board,板上集成缓存)
7/yd@#$X COB(Cache on board,板上集成缓存)
lu}[XN COD(Cache on Die,芯片内集成缓存)
#}Cwn$ COD(Cache on Die,芯片内集成缓存)
0t&H1xsxX COM: Component Object Model(组件对象模式)
sg y COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
.edZKmC6 compressed textures(压缩纹理)
G@'0vYb# Concurrent Command Engine,协作命令引擎
K_xOY
* COO(Chief Organizer Officer,首席管理官)
h^c'L=dR CP: Ceramic Package(陶瓷封装)
(l,o UBRr CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
sDC RL%0QK CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
5C&f-* Bh CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
|q>Mw-= CPS: Certification Practice Statement(使用证明书)
r6)1Y`K=9 CPU(Center Processing Unit,中央处理器)
5 6R,+sN CPU: Centerl Processing Unit(中央处理器)
EpfmH ` CPU:Center Processing Unit,中央处理器
S ] &->5" CRC: Cyclical Redundancy Check(循环冗余检查)
K|/a]I": CRT(Cathode Ray Tube,阴极射线管)
+u2Co_FJ& CS(Channel Separation,声道分离)
; n@C(hG CSE(Configuration Space Enable,可分配空间)
h.^DRR^S CSS(Common Command Set,通用指令集)
O
o:jP6r CSS: Cascading Style Sheets,层叠格式表
E.3}a>f CTO(Chief Technology Officer,首席技术官)
7AiCQWf9 CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
[ bW=>M CTS(Clear to Send,清除发送)
3{z|301<m CVS(Compute Visual Syndrome,计算机视觉综合症)