作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
Pu=YQ
#F' 3DNow!(3D no waiting)
&:rf80`z. 3DPA(3D Positional Audio,3D定位音频)
Ae"B]Cxb_X 3DS(3D SubSystem,三维子系统)
]]+"`t,- ABS(Auto Balance System,自动平衡系统)
O?@AnkOhn AC(Audio Codec,音频多媒体数字信号编解码器)
s^cHR1^ ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
[8ih-k ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
o.,hCg)X AE(Atmospheric Effects,雾化效果)
8O]$)E AFR(Alternate Frame Rendering,交替渲染技术)
?n}L+| AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
^W^%PJD| AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
[|vdr. AGU(Address Generation Units,地址产成单元)
b<%6aRC\ AH: Authentication Header,鉴定文件头
#}.db?[Rv AHA(Accelerated Hub Architecture,加速中心架构)
dP82bk/e AL: Artificial Life(人工生命)
C[75!F ALU(Arithmetic Logic Unit,算术逻辑单元)
1'ZBtX~A AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
&a V`u?'e AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
TV} H Anisotropic Filtering(各向异性过滤)
bFcI\Q{4 API(Application Programming Interfaces,应用程序接口)
!( /dbHB APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
\Q]7Hw< APM(Advanced Power Management,高级能源管理)
N*eZ4s' APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
DUaj]V{_^ ARP(Address Resolution Protocol,地址解析协议)
L9T|* ?|| ASC(Anti Static Coatings,防静电涂层)
_s^sZ{'2_ ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
'h$1vT ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
T5ol2 ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
:p89J\ ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
_f/6bpv ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
biQDupTz ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
jVr:O` AST(Average Seek time,平均寻道时间)
-{^Gzui ATA(AT Attachment,AT扩展型)
vForj*Xo ATAPI(AT Attachment Packet Interface)
b^0=X!bg ATC(Access Time from Clock,时钟存取时间)
y:m Xv<g ATL: ActiveX Template Library(ActiveX模板库)
V
V<Zl ATM(Asynchronous Transfer Mode,异步传输模式)
Z\n
nVM= ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
bO9X;}\6 ATX: AT Extend(扩展型AT)
|(]XZ !{ Auxiliary Input(辅助输入接口)
5~v({R. AV(Analog Video,模拟视频)
k/>k&^? AVI(Audio Video Interleave,音频视频插入)
Z<`QDBN"4 Back Buffer,后置缓冲
3qP!
(* Backface culling(隐面消除)
nBR4j?':i BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
yN9/'c~ Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
Mp}U>+8 BCF(Boot Catalog File,启动目录文件)
up1kg>i%" Benchmarks:基准测试程序数值
t\ ym4`" BGA(Ball Grid Array,球状矩阵排列)
s~3"*,3@ BGA(Ball Grid Array,球状矩阵排列)
{>9vm!<[*\ BGA: Ball Grid Array(球状网格阵列)
hjyM xg;Q? BHT(branch prediction table,分支预测表)
]~2iducB, BIF(Boot Image File,启动映像文件)
}yVx"e) Bilinear Filtering(双线性过滤)
aVCPaYe^ BIOS(Basic Input/Output System,基本输入/输出系统)
_3(rwD BLA: Bearn Landing Area(电子束落区)
)(0if0D4 BMC(Black Matrix Screen,超黑矩阵屏幕)
Idb*,l|< BOD(Bandwidth On Demand,弹性带宽运用)
M287Z[ BOPS:Billion Operations Per Second,十亿次运算/秒
~7 `,}) d bps(bit per second,位/秒)
G9NI`]k BPU(Branch Processing Unit,分支处理单元)
3Q'vVNFh< Brach Pediction(分支预测)
/poGhB1k BSD(Berkeley Software Distribution,伯克利软件分配代号)
|.VSw BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
^s6}[LDW>@ BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
}4N'as/ZO C2C: card-to-card interleaving,卡到卡交错存取
8OKG@hc CAD: computer-aided design,计算机辅助设计
qg{gCG CAM(Common Access Model,公共存取模型)
7HkFDI()1 CAS(Column Address Strobe,列地址控制器)
}f;WYz 5 CBR(Committed Burst Rate,约定突发速率)
/{f"0]-RA CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
Qo)Da}uo20 CCD(Charge Coupled Device,电荷连接设备)
&Ts!#OcB, CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
eZEk$W% CCM(Call Control Manager,拨号控制管理)
fX]`vjM{ cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
r1}^\C CCS(Cut Change System)
"MU-&** CCT(Clock Cycle Time,时钟周期)
<pfl>Uf CDR(CD Recordable,可记录光盘)
+: x[cK CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
(>vyWd] CDRW(CD-Rewritable,可重复刻录光盘)
md*U CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
[3"F$?e5 CE(Consumer Electronics,消费电子)
vn+XY=Qnr CEM(cube environment mapping,立方环境映射)
gUNhN1= Center Processing Unit Utilization,中央处理器占用率
/cb`%"Z CEO(Chief Executive Officer,首席执行官)
5mQ@&E~#W CG(Computer Graphics,计算机生成图像)
@4hzNi+ CGI(Common Gateway Interface,通用网关接口)
5CZyA`3V^5 CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
~v%6*9 CIEA: Commercial Internet Exchange Association,商业因特网交易协会
uLafO=Q CIR(Committed Infomation Rate,约定信息速率)
0u1ZU4+EC CISC(Complex Instruction Set Computing,复杂指令集计算机)
}%p:Xv@X! CISC(Complex Instruction Set Computing,复杂指令集计算机)
-Y@tx fu- CISC: Complex Instruction Set Computing(复杂指令结构)
p;>A:i Clipping(剪贴纹理)
`mzlOB CLK(Clock Cycle,时钟周期)
5afD;0D5TI Clock Synthesizer,时钟合成器
Xd=KBB[r? CLV(Constant Linear Velocity,恒定线速度)
`p&[b]b CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
<a]i"s CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
HD^#" CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
\rFS^# COB(Cache on board,板上集成缓存)
B~w$j/sWU COB(Cache on board,板上集成缓存)
1(-!TJ{ COD(Cache on Die,芯片内集成缓存)
H"FK(N\ COD(Cache on Die,芯片内集成缓存)
r|EN 5 COM: Component Object Model(组件对象模式)
4p,:}h COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
8@;]@c)m compressed textures(压缩纹理)
eCYPd-d Concurrent Command Engine,协作命令引擎
r }lGcG) COO(Chief Organizer Officer,首席管理官)
?qNU*d CP: Ceramic Package(陶瓷封装)
oT-gZedW( CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
^O18\a CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
kJJT`Ba&/ CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
bZ\R0[0 CPS: Certification Practice Statement(使用证明书)
dymq
Z< CPU(Center Processing Unit,中央处理器)
v>_@D@pr CPU: Centerl Processing Unit(中央处理器)
~Q&J\'GQH CPU:Center Processing Unit,中央处理器
U05;qKgkDF CRC: Cyclical Redundancy Check(循环冗余检查)
&"^F;z/ CRT(Cathode Ray Tube,阴极射线管)
lS4r pbU_ CS(Channel Separation,声道分离)
&Q3Fgj CSE(Configuration Space Enable,可分配空间)
GGp.u@\r CSS(Common Command Set,通用指令集)
=6u@JpOl CSS: Cascading Style Sheets,层叠格式表
r[S(VPo[() CTO(Chief Technology Officer,首席技术官)
<y@vv CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
XOvJlaY)'. CTS(Clear to Send,清除发送)
/'sv7hg+ CVS(Compute Visual Syndrome,计算机视觉综合症)