作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
71AYDO 3DNow!(3D no waiting)
uk$MQv*D 3DPA(3D Positional Audio,3D定位音频)
A_U=`M=- 3DS(3D SubSystem,三维子系统)
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#2}, ABS(Auto Balance System,自动平衡系统)
ibQ
xL3 AC(Audio Codec,音频多媒体数字信号编解码器)
j[dZ*Jr_ ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
F::Ki4{jJ ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
rL"]m_FK AE(Atmospheric Effects,雾化效果)
2%R.~9HtA AFR(Alternate Frame Rendering,交替渲染技术)
+<p&Va# AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
6AY(/N8V AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
L7(FDv,? AGU(Address Generation Units,地址产成单元)
e/+.^ '{ AH: Authentication Header,鉴定文件头
GU/P%c/V AHA(Accelerated Hub Architecture,加速中心架构)
7"aN7Q+EbI AL: Artificial Life(人工生命)
LB]3-FsU+ ALU(Arithmetic Logic Unit,算术逻辑单元)
m`8{arz2 AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
mCg^Y)Q AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
Nk\ni>Du3 Anisotropic Filtering(各向异性过滤)
GEVDXx>@ API(Application Programming Interfaces,应用程序接口)
$#5'c+0 APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
b~tu;: APM(Advanced Power Management,高级能源管理)
dg#Pb@7a APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
}qp)VF ARP(Address Resolution Protocol,地址解析协议)
$X Uck[ ASC(Anti Static Coatings,防静电涂层)
:PN%'~}n ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
4FYV]p8f ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
MmvJ)|&t ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
w$iPFZC' ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
JK!`uG+v ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
)_j(NX-C: ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
T`]%$$1s AST(Average Seek time,平均寻道时间)
^}vf ATA(AT Attachment,AT扩展型)
1@'I eywg ATAPI(AT Attachment Packet Interface)
-UidU+ES; ATC(Access Time from Clock,时钟存取时间)
0!%G#~th ATL: ActiveX Template Library(ActiveX模板库)
%?+Lkj& ATM(Asynchronous Transfer Mode,异步传输模式)
!a\v)R ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
zTMLE~w ATX: AT Extend(扩展型AT)
&Lzd*}7 Auxiliary Input(辅助输入接口)
T'lycc4~a AV(Analog Video,模拟视频)
SOsz=bVx AVI(Audio Video Interleave,音频视频插入)
(m!kg Back Buffer,后置缓冲
fHZ9wK> Backface culling(隐面消除)
xa]yq% BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
V73/q Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
W-r^ME BCF(Boot Catalog File,启动目录文件)
rt*>)GI]b Benchmarks:基准测试程序数值
Io
IhQ BGA(Ball Grid Array,球状矩阵排列)
K>~YO~~ BGA(Ball Grid Array,球状矩阵排列)
`q^qe> ' BGA: Ball Grid Array(球状网格阵列)
tXrKC BHT(branch prediction table,分支预测表)
7;TMxO=bra BIF(Boot Image File,启动映像文件)
w]h8KNt Bilinear Filtering(双线性过滤)
n;=FD;}j+ BIOS(Basic Input/Output System,基本输入/输出系统)
SnUR?k1 BLA: Bearn Landing Area(电子束落区)
"R)n1,0 BMC(Black Matrix Screen,超黑矩阵屏幕)
VR"le&'z" BOD(Bandwidth On Demand,弹性带宽运用)
w1zMY:9 BOPS:Billion Operations Per Second,十亿次运算/秒
sxuP"4 bps(bit per second,位/秒)
)AcevEHB BPU(Branch Processing Unit,分支处理单元)
Qp:m=f6@ Brach Pediction(分支预测)
+{;wOQ. BSD(Berkeley Software Distribution,伯克利软件分配代号)
XGe;v~L BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
c]U+6JH BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
TT3GGHR C2C: card-to-card interleaving,卡到卡交错存取
ct,;V/Dx CAD: computer-aided design,计算机辅助设计
|Axbx? CAM(Common Access Model,公共存取模型)
T)q
Uf
H CAS(Column Address Strobe,列地址控制器)
Jo;&~/V
CBR(Committed Burst Rate,约定突发速率)
2-UD^;0 CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
jvR(e" CCD(Charge Coupled Device,电荷连接设备)
0cfGI% CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
:6(@P1vA 6 CCM(Call Control Manager,拨号控制管理)
_ 3>E+9TQ cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
E&t8nlTx CCS(Cut Change System)
16@<G CCT(Clock Cycle Time,时钟周期)
jHHCJOHB8 CDR(CD Recordable,可记录光盘)
>y#qn9rV1 CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
uxKO" CDRW(CD-Rewritable,可重复刻录光盘)
Pq{p\Qkj CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
H13\8Te{ CE(Consumer Electronics,消费电子)
/D|q-`*K CEM(cube environment mapping,立方环境映射)
T <k;^iqR Center Processing Unit Utilization,中央处理器占用率
y.8nzlkE{ CEO(Chief Executive Officer,首席执行官)
(5+g:mSfr CG(Computer Graphics,计算机生成图像)
726UO#* CGI(Common Gateway Interface,通用网关接口)
Rq?t=7fX) CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
hG<[F@d CIEA: Commercial Internet Exchange Association,商业因特网交易协会
Q3bU"f CIR(Committed Infomation Rate,约定信息速率)
)ryP K"V CISC(Complex Instruction Set Computing,复杂指令集计算机)
z9
#- CISC(Complex Instruction Set Computing,复杂指令集计算机)
Xnh&Kyz`v CISC: Complex Instruction Set Computing(复杂指令结构)
DYIp2-K Clipping(剪贴纹理)
HSU?4=Q CLK(Clock Cycle,时钟周期)
!v%>W< 3Q Clock Synthesizer,时钟合成器
Vom,^`} CLV(Constant Linear Velocity,恒定线速度)
br k*; CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
2Ir*}s2{ CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
rp1+K4]P CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
EX, {1^h COB(Cache on board,板上集成缓存)
ve.P{;;Ky COB(Cache on board,板上集成缓存)
:mLXB75gH COD(Cache on Die,芯片内集成缓存)
ZpBP#Y* COD(Cache on Die,芯片内集成缓存)
ij3W8i9' COM: Component Object Model(组件对象模式)
cCx{
") COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
)~nieQEZQ compressed textures(压缩纹理)
eFA,xzp Concurrent Command Engine,协作命令引擎
DC BN89# COO(Chief Organizer Officer,首席管理官)
(@^ySiU CP: Ceramic Package(陶瓷封装)
l1L8a I,8 CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
ug;\`.nT^ CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
?0JNaf CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
q*a~9.i@ CPS: Certification Practice Statement(使用证明书)
g$hEVT CPU(Center Processing Unit,中央处理器)
{t|#>UCK CPU: Centerl Processing Unit(中央处理器)
_]D
6m2R CPU:Center Processing Unit,中央处理器
iG~&uEAJ CRC: Cyclical Redundancy Check(循环冗余检查)
n6Z!~W8 CRT(Cathode Ray Tube,阴极射线管)
j]R[;8g CS(Channel Separation,声道分离)
`2x. - CSE(Configuration Space Enable,可分配空间)
gnxD'1_ CSS(Common Command Set,通用指令集)
CM[83> CSS: Cascading Style Sheets,层叠格式表
Pq(LW( CTO(Chief Technology Officer,首席技术官)
1:@ScHS CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
w5/6+@} CTS(Clear to Send,清除发送)
f:~$x CVS(Compute Visual Syndrome,计算机视觉综合症)