作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
>~+'V.CNW 3DNow!(3D no waiting)
;%#.d$cU 3DPA(3D Positional Audio,3D定位音频)
7v{X?86& 3DS(3D SubSystem,三维子系统)
zB/)_AW
ABS(Auto Balance System,自动平衡系统)
Sj,>O:p AC(Audio Codec,音频多媒体数字信号编解码器)
P#gY-k&Nr ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
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SM ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
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jiA1 AE(Atmospheric Effects,雾化效果)
( E8(np AFR(Alternate Frame Rendering,交替渲染技术)
ZUkrJ' AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
e*nT+Rp AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
.u<i<S AGU(Address Generation Units,地址产成单元)
F9N/_H*+ AH: Authentication Header,鉴定文件头
mN!5JZ'2 AHA(Accelerated Hub Architecture,加速中心架构)
MfJs?N0 AL: Artificial Life(人工生命)
@Czj] t` ALU(Arithmetic Logic Unit,算术逻辑单元)
GS<aXhk AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
~7kIe+V AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
vt(A?$j|A Anisotropic Filtering(各向异性过滤)
R)[ l3 API(Application Programming Interfaces,应用程序接口)
"s?!1v(v APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
r.JY88" APM(Advanced Power Management,高级能源管理)
$y2"Q,n+ APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
G$P|F6
ARP(Address Resolution Protocol,地址解析协议)
"OdR"M(G\ ASC(Anti Static Coatings,防静电涂层)
H#Aar ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
YtQsSU ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
QH)uh" ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
~qjnV ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
5O7x4bY ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
y4^w8'%MC ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
\G+uK:PC, AST(Average Seek time,平均寻道时间)
+nLsiC{& ATA(AT Attachment,AT扩展型)
31FQ=(K ATAPI(AT Attachment Packet Interface)
.q!U@}k. ATC(Access Time from Clock,时钟存取时间)
^Z6N&s#6 ATL: ActiveX Template Library(ActiveX模板库)
! u4'1jd[d ATM(Asynchronous Transfer Mode,异步传输模式)
C>A*L4c]F ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
JQ[~N- ATX: AT Extend(扩展型AT)
r )pg9}+ Auxiliary Input(辅助输入接口)
xs'vd:l.Pp AV(Analog Video,模拟视频)
N:_U2[V^d AVI(Audio Video Interleave,音频视频插入)
!yfQ^a_O Back Buffer,后置缓冲
c)7i%RF' Backface culling(隐面消除)
>$%rs c}^ BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
Os9;;^k Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
*irYSTA$ BCF(Boot Catalog File,启动目录文件)
Sz"rp9x+ Benchmarks:基准测试程序数值
f0<'IgN BGA(Ball Grid Array,球状矩阵排列)
x|TLMu=3= BGA(Ball Grid Array,球状矩阵排列)
qh40nqS;9 BGA: Ball Grid Array(球状网格阵列)
fw[Z7`\Q5 BHT(branch prediction table,分支预测表)
`.0WK BIF(Boot Image File,启动映像文件)
Zn-F !Lsv Bilinear Filtering(双线性过滤)
s}O9[_v BIOS(Basic Input/Output System,基本输入/输出系统)
ya*KA.EGg BLA: Bearn Landing Area(电子束落区)
'`+GC9VG BMC(Black Matrix Screen,超黑矩阵屏幕)
McXid~ BOD(Bandwidth On Demand,弹性带宽运用)
IM^K]$q$47 BOPS:Billion Operations Per Second,十亿次运算/秒
A3;}C+K bps(bit per second,位/秒)
!_ng_,J BPU(Branch Processing Unit,分支处理单元)
Y NRorE
Brach Pediction(分支预测)
<8'-azpJ6< BSD(Berkeley Software Distribution,伯克利软件分配代号)
t+2!"Jr BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
Vk#wJ- BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
byyzXRO; C2C: card-to-card interleaving,卡到卡交错存取
2G(RQ\Ro* CAD: computer-aided design,计算机辅助设计
$_u9Y! CAM(Common Access Model,公共存取模型)
7*a']W{aJ CAS(Column Address Strobe,列地址控制器)
i6.HR?n CBR(Committed Burst Rate,约定突发速率)
+O2z&a;q CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
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( CCD(Charge Coupled Device,电荷连接设备)
,rC$~
& CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
BS6UXAf{|Z CCM(Call Control Manager,拨号控制管理)
I Ceb2R cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
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,y CCS(Cut Change System)
b/yXE)3
X CCT(Clock Cycle Time,时钟周期)
(B0tgg^jj, CDR(CD Recordable,可记录光盘)
AJ:(NV1= CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
1pM"j! CDRW(CD-Rewritable,可重复刻录光盘)
RTEzcJ> CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
A<+veqb4 CE(Consumer Electronics,消费电子)
}H>}v/ CEM(cube environment mapping,立方环境映射)
U^xz>:~ Center Processing Unit Utilization,中央处理器占用率
Jxq;Uu9 CEO(Chief Executive Officer,首席执行官)
3Dm`8Xt
CG(Computer Graphics,计算机生成图像)
7M#irCX CGI(Common Gateway Interface,通用网关接口)
)PU_'n=> CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
` !JcQ'u CIEA: Commercial Internet Exchange Association,商业因特网交易协会
$O)fHD' CIR(Committed Infomation Rate,约定信息速率)
]W7e2:Hra CISC(Complex Instruction Set Computing,复杂指令集计算机)
N
N1(f CISC(Complex Instruction Set Computing,复杂指令集计算机)
V1 H3} CISC: Complex Instruction Set Computing(复杂指令结构)
2<
"- Clipping(剪贴纹理)
&* Aems{- CLK(Clock Cycle,时钟周期)
7a0kat'\ Clock Synthesizer,时钟合成器
Q#Vg5H4 CLV(Constant Linear Velocity,恒定线速度)
+im>| CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
ZbZCW:8>k CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
g~A~|di| CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
gXQ
s)Eyv COB(Cache on board,板上集成缓存)
??7c9l5, COB(Cache on board,板上集成缓存)
(9_O||ee COD(Cache on Die,芯片内集成缓存)
^1b/Y8&8A COD(Cache on Die,芯片内集成缓存)
qkg`4'rLg COM: Component Object Model(组件对象模式)
1
po.Cmx COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
bH7 lUS~ compressed textures(压缩纹理)
o~(/Twxam Concurrent Command Engine,协作命令引擎
I|SQhbi COO(Chief Organizer Officer,首席管理官)
XEB1%. p CP: Ceramic Package(陶瓷封装)
';\v:dP CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
#7Pnw.s3zz CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
S
6|#9C& CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
>7[o=!^:4 CPS: Certification Practice Statement(使用证明书)
Vzs_g]V CPU(Center Processing Unit,中央处理器)
Q8~|0X\.g CPU: Centerl Processing Unit(中央处理器)
DC5^k[m CPU:Center Processing Unit,中央处理器
S%sD#0l CRC: Cyclical Redundancy Check(循环冗余检查)
|P>Yf0 CRT(Cathode Ray Tube,阴极射线管)
Ow@}6&1 CS(Channel Separation,声道分离)
/jtU<uX CSE(Configuration Space Enable,可分配空间)
TrEo5H ; CSS(Common Command Set,通用指令集)
uE]kv CSS: Cascading Style Sheets,层叠格式表
t@Bl3Nt{ CTO(Chief Technology Officer,首席技术官)
ZliJc7lss CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
@rV|7%u CTS(Clear to Send,清除发送)
{?zBc E: CVS(Compute Visual Syndrome,计算机视觉综合症)