作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
lITd{E,+r 3DNow!(3D no waiting)
DOyO`TJi 3DPA(3D Positional Audio,3D定位音频)
^p(aZj3k 3DS(3D SubSystem,三维子系统)
((gI OTV ABS(Auto Balance System,自动平衡系统)
dEYw_qJ2 AC(Audio Codec,音频多媒体数字信号编解码器)
b'pwRKpx ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
L9) gN.# ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
P[fy AE(Atmospheric Effects,雾化效果)
'/`O*KD] AFR(Alternate Frame Rendering,交替渲染技术)
|ru!C( AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
d5-Q}D,P AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
>r`O@`^U AGU(Address Generation Units,地址产成单元)
]#NfH-T AH: Authentication Header,鉴定文件头
g7323m1= AHA(Accelerated Hub Architecture,加速中心架构)
(A=PDjP! AL: Artificial Life(人工生命)
ou0TKE9
_ ALU(Arithmetic Logic Unit,算术逻辑单元)
(+gTIcc
> AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
kb 74: AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
d>u^7: Anisotropic Filtering(各向异性过滤)
z#G\D5yX[* API(Application Programming Interfaces,应用程序接口)
xD*Zcw(vj~ APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
{ccc[G?>.Q APM(Advanced Power Management,高级能源管理)
8b0j rt APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
g5U, ARP(Address Resolution Protocol,地址解析协议)
ItLR|LO9 ASC(Anti Static Coatings,防静电涂层)
;G`]`=s#Lq ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
(}wPu&Is,C ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
yl?LXc[) ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
M gP|'H3\ ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
`IlhLv ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
x#E
M)Thq ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
QeF:s|[ AST(Average Seek time,平均寻道时间)
SN)Czi#7
ATA(AT Attachment,AT扩展型)
DI)"FOM6 ATAPI(AT Attachment Packet Interface)
a;dWM(;Kw ATC(Access Time from Clock,时钟存取时间)
.WSn Y71 ATL: ActiveX Template Library(ActiveX模板库)
n3?P8m$ ATM(Asynchronous Transfer Mode,异步传输模式)
0#GnmH ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
E
uO:}[ ATX: AT Extend(扩展型AT)
V}TPt6C2 Auxiliary Input(辅助输入接口)
tX%
C5k AV(Analog Video,模拟视频)
6Z1O:Bou AVI(Audio Video Interleave,音频视频插入)
1/1oT Back Buffer,后置缓冲
H,<CR9@(5d Backface culling(隐面消除)
FS8l}t BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
gna!Q Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
M
&-p BCF(Boot Catalog File,启动目录文件)
=oXlJ[)h Benchmarks:基准测试程序数值
POm;lM$ BGA(Ball Grid Array,球状矩阵排列)
xuHP4$<h3 BGA(Ball Grid Array,球状矩阵排列)
lq-F*r\/~+ BGA: Ball Grid Array(球状网格阵列)
OqsuuE BHT(branch prediction table,分支预测表)
5M> p%/ BIF(Boot Image File,启动映像文件)
zEQQ4)mA Bilinear Filtering(双线性过滤)
}^H(EHE BIOS(Basic Input/Output System,基本输入/输出系统)
tYMr BLA: Bearn Landing Area(电子束落区)
E9k%:&]vd BMC(Black Matrix Screen,超黑矩阵屏幕)
[Cd#<Te3 BOD(Bandwidth On Demand,弹性带宽运用)
2@T0QJ BOPS:Billion Operations Per Second,十亿次运算/秒
fN{wP,jI bps(bit per second,位/秒)
[jNVk3 BPU(Branch Processing Unit,分支处理单元)
D*46,>Tv Brach Pediction(分支预测)
5O~xj: BSD(Berkeley Software Distribution,伯克利软件分配代号)
;s~xS*(C BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
Dd0yQgCu BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
E\Wd*,/v) C2C: card-to-card interleaving,卡到卡交错存取
+?t&
7={~ CAD: computer-aided design,计算机辅助设计
K~]Xx~F CAM(Common Access Model,公共存取模型)
})!- CAS(Column Address Strobe,列地址控制器)
StR)O))I CBR(Committed Burst Rate,约定突发速率)
_@?I)4n| CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
wmK;0 )|H CCD(Charge Coupled Device,电荷连接设备)
-A}$5/ CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
+R$;LtR CCM(Call Control Manager,拨号控制管理)
3#""`]9H cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
RKMF?: CCS(Cut Change System)
ku57<kb CCT(Clock Cycle Time,时钟周期)
QHXpX9 CDR(CD Recordable,可记录光盘)
s(5(zcBK CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
s%#u)nw19 CDRW(CD-Rewritable,可重复刻录光盘)
qc'KQ5w7! CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
8DD1wK\U~ CE(Consumer Electronics,消费电子)
UC`sq-n CEM(cube environment mapping,立方环境映射)
ZHwN3 Center Processing Unit Utilization,中央处理器占用率
~y Dl& S CEO(Chief Executive Officer,首席执行官)
i+Ne.h CG(Computer Graphics,计算机生成图像)
W7s CGI(Common Gateway Interface,通用网关接口)
R/B/|x CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
7"eIZ CIEA: Commercial Internet Exchange Association,商业因特网交易协会
R))4J CIR(Committed Infomation Rate,约定信息速率)
?TDmW8G}J CISC(Complex Instruction Set Computing,复杂指令集计算机)
dhg($m CISC(Complex Instruction Set Computing,复杂指令集计算机)
wko9tdC=U CISC: Complex Instruction Set Computing(复杂指令结构)
-'oxenu Clipping(剪贴纹理)
@VND}{j CLK(Clock Cycle,时钟周期)
bQ?Vh@j(M Clock Synthesizer,时钟合成器
@d5t%V\ CLV(Constant Linear Velocity,恒定线速度)
nJgN2Z CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
^eV K. CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
&B+_#V=X@ CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
\ z*<^ONq COB(Cache on board,板上集成缓存)
I8W9Kzf COB(Cache on board,板上集成缓存)
0aGauG[ COD(Cache on Die,芯片内集成缓存)
,rY}IwMw COD(Cache on Die,芯片内集成缓存)
K^/.v<w COM: Component Object Model(组件对象模式)
v!S(T];) COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
Q^Vch(`&P compressed textures(压缩纹理)
Efd@\m:~> Concurrent Command Engine,协作命令引擎
t=fAG,k5 COO(Chief Organizer Officer,首席管理官)
!t)uRJ CP: Ceramic Package(陶瓷封装)
<X5V]f CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
zEE:C|50 CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
VK%ExMSqEh CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
-G1R><8[ CPS: Certification Practice Statement(使用证明书)
0|\JbM CPU(Center Processing Unit,中央处理器)
t1#f*G5 CPU: Centerl Processing Unit(中央处理器)
mCI5^%*0jQ CPU:Center Processing Unit,中央处理器
w(Mi? CRC: Cyclical Redundancy Check(循环冗余检查)
|c$*Fa"A CRT(Cathode Ray Tube,阴极射线管)
bL:+(/: CS(Channel Separation,声道分离)
K(NP%: CSE(Configuration Space Enable,可分配空间)
]3U|K .G CSS(Common Command Set,通用指令集)
2fm6G).m CSS: Cascading Style Sheets,层叠格式表
\u/=?b CTO(Chief Technology Officer,首席技术官)
527u d^: CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
MqWM!v-M CTS(Clear to Send,清除发送)
-S@ ys CVS(Compute Visual Syndrome,计算机视觉综合症)