作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
,0L< wa 3DNow!(3D no waiting)
),<h6$ 3DPA(3D Positional Audio,3D定位音频)
(1,4egMpR 3DS(3D SubSystem,三维子系统)
uxrNkZia ABS(Auto Balance System,自动平衡系统)
4pDZ +}p AC(Audio Codec,音频多媒体数字信号编解码器)
Kd#64NSi$A ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
PHsM)V+ ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
NFU=PS$ AE(Atmospheric Effects,雾化效果)
G4F~V't AFR(Alternate Frame Rendering,交替渲染技术)
#.j:P# AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
9 Up>e AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
Rlr[uU_ AGU(Address Generation Units,地址产成单元)
Yk4ah$}%-^ AH: Authentication Header,鉴定文件头
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L#b*( AHA(Accelerated Hub Architecture,加速中心架构)
,!~U5~ AL: Artificial Life(人工生命)
4[0.M ALU(Arithmetic Logic Unit,算术逻辑单元)
)sEAPIka AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
a(U/70j AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
n[-d~ Ce2{ Anisotropic Filtering(各向异性过滤)
a.<!>o<t: API(Application Programming Interfaces,应用程序接口)
@S012} xH APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
[o'}R`5) APM(Advanced Power Management,高级能源管理)
+w?1<Z APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
v|kL7t)} ARP(Address Resolution Protocol,地址解析协议)
QD[l 6 ASC(Anti Static Coatings,防静电涂层)
IetV ]Ff6 ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
Z${@;lgP ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
B@3>_};Ct ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
BW)t2kR& ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
zHj_q%A ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
KrECAc ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
@0:mP AST(Average Seek time,平均寻道时间)
M+Y^ A7 ATA(AT Attachment,AT扩展型)
Z*5]qh2r8 ATAPI(AT Attachment Packet Interface)
z:$TW{%M ATC(Access Time from Clock,时钟存取时间)
P[cGCmM ATL: ActiveX Template Library(ActiveX模板库)
YAF0I%PYU ATM(Asynchronous Transfer Mode,异步传输模式)
?y{"OuRf. ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
H~qY7t ATX: AT Extend(扩展型AT)
!I8(Y Auxiliary Input(辅助输入接口)
5a l44[ AV(Analog Video,模拟视频)
E }w<-]8 AVI(Audio Video Interleave,音频视频插入)
PI")^` Back Buffer,后置缓冲
wa9{Q}wSa Backface culling(隐面消除)
fI(H
:N BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
qoD
M!~ Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
QeAkuqT'[ BCF(Boot Catalog File,启动目录文件)
M8lR#2n| Benchmarks:基准测试程序数值
Neb%D8/Kn BGA(Ball Grid Array,球状矩阵排列)
<Gu dx>I BGA(Ball Grid Array,球状矩阵排列)
kA:cz$) BGA: Ball Grid Array(球状网格阵列)
g>R md[!/ BHT(branch prediction table,分支预测表)
d3C*]|gQ BIF(Boot Image File,启动映像文件)
QO~TuC Bilinear Filtering(双线性过滤)
z//6yr BIOS(Basic Input/Output System,基本输入/输出系统)
8>jd2'v{ BLA: Bearn Landing Area(电子束落区)
Y-,1&$& BMC(Black Matrix Screen,超黑矩阵屏幕)
0r\hX6 k BOD(Bandwidth On Demand,弹性带宽运用)
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YSk d BOPS:Billion Operations Per Second,十亿次运算/秒
\+w -{"u$ bps(bit per second,位/秒)
V/!8q`lYNJ BPU(Branch Processing Unit,分支处理单元)
1z(y>`ZBq Brach Pediction(分支预测)
Ts:pk BSD(Berkeley Software Distribution,伯克利软件分配代号)
hMx/}Tw wt BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
cYTX)]^u BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
xH8nn3U C2C: card-to-card interleaving,卡到卡交错存取
:U;ZBs3 CAD: computer-aided design,计算机辅助设计
`Uw^,r CAM(Common Access Model,公共存取模型)
P3YG:* CAS(Column Address Strobe,列地址控制器)
bsmnh_YRj CBR(Committed Burst Rate,约定突发速率)
Om2
)$( CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
L7*~8Y CCD(Charge Coupled Device,电荷连接设备)
BT+ws@|[ CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
WYE[H9x1? CCM(Call Control Manager,拨号控制管理)
Z5{M_^ cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
\*w*Q(&3 CCS(Cut Change System)
CLD*\)QD\ CCT(Clock Cycle Time,时钟周期)
HgX4RSU CDR(CD Recordable,可记录光盘)
[w)6OT CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
'm"H*f CDRW(CD-Rewritable,可重复刻录光盘)
ji2if.t@ CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
'u.`!w '|L CE(Consumer Electronics,消费电子)
T ~t%3G
CEM(cube environment mapping,立方环境映射)
G";yqG Center Processing Unit Utilization,中央处理器占用率
XH2g:$ CEO(Chief Executive Officer,首席执行官)
,k@fXoW CG(Computer Graphics,计算机生成图像)
^IM;D)X&: CGI(Common Gateway Interface,通用网关接口)
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1M5Dm CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
NzRL(A6V CIEA: Commercial Internet Exchange Association,商业因特网交易协会
F:M3^I CIR(Committed Infomation Rate,约定信息速率)
v *~ yN* CISC(Complex Instruction Set Computing,复杂指令集计算机)
~GS`@IU} CISC(Complex Instruction Set Computing,复杂指令集计算机)
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Y:F( CISC: Complex Instruction Set Computing(复杂指令结构)
c{#lKD<7 Clipping(剪贴纹理)
gy<pN?Mw CLK(Clock Cycle,时钟周期)
9!FV.yp%F Clock Synthesizer,时钟合成器
^QV;[ha,o CLV(Constant Linear Velocity,恒定线速度)
t L;;Yt CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
c:~o e CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
4(YKwY2_L CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
Jo
h&Ay COB(Cache on board,板上集成缓存)
/sdkQ{J!. COB(Cache on board,板上集成缓存)
,)Z^b$H] COD(Cache on Die,芯片内集成缓存)
Mi'eViH COD(Cache on Die,芯片内集成缓存)
'J<KL#og COM: Component Object Model(组件对象模式)
<<&:BK COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
#!y|cP~;I compressed textures(压缩纹理)
^#%$?w>wI Concurrent Command Engine,协作命令引擎
ZwF_hm=/[ COO(Chief Organizer Officer,首席管理官)
@eT!v{o CP: Ceramic Package(陶瓷封装)
NCSb`SC: CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
/tP"r}l CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
Q9#$4 CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
o *I-~k CPS: Certification Practice Statement(使用证明书)
{q8V CPU(Center Processing Unit,中央处理器)
P RX:*0 CPU: Centerl Processing Unit(中央处理器)
XX}RbE#4 CPU:Center Processing Unit,中央处理器
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"y{d@ CRC: Cyclical Redundancy Check(循环冗余检查)
94|BSxc CRT(Cathode Ray Tube,阴极射线管)
=UNzjmP503 CS(Channel Separation,声道分离)
";",r^vr\ CSE(Configuration Space Enable,可分配空间)
HPwmi[ CSS(Common Command Set,通用指令集)
uu=e~K CSS: Cascading Style Sheets,层叠格式表
{My/+{eS!? CTO(Chief Technology Officer,首席技术官)
6eK18*j%H CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
S <|e/![@ CTS(Clear to Send,清除发送)
O,xU+j~) CVS(Compute Visual Syndrome,计算机视觉综合症)