作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
BT3yrq9 3DNow!(3D no waiting)
$i!r> .Jo 3DPA(3D Positional Audio,3D定位音频)
E*,nKJu'r 3DS(3D SubSystem,三维子系统)
u35"oLV6}# ABS(Auto Balance System,自动平衡系统)
[yc7F0Aw AC(Audio Codec,音频多媒体数字信号编解码器)
el2<W=^M ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
'9Q#%E!* ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
#2Vq"Zn AE(Atmospheric Effects,雾化效果)
jlqSw4_ AFR(Alternate Frame Rendering,交替渲染技术)
|-cXb.M[ AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
%(K} 1[ AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
tef>Py AGU(Address Generation Units,地址产成单元)
B:cQsaty AH: Authentication Header,鉴定文件头
n`jG[{3t& AHA(Accelerated Hub Architecture,加速中心架构)
%z.d;[Hs AL: Artificial Life(人工生命)
;"RyHow ALU(Arithmetic Logic Unit,算术逻辑单元)
COBjJ3 AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
X1[zkb AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
UV{})T*s Anisotropic Filtering(各向异性过滤)
Nm-E4N#'i API(Application Programming Interfaces,应用程序接口)
(4C)]
RHQ APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
:v$)Z~ APM(Advanced Power Management,高级能源管理)
tehWGqx) APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
ZnuRy: ARP(Address Resolution Protocol,地址解析协议)
*xj2Z,u ASC(Anti Static Coatings,防静电涂层)
uz20pun4B ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
2#/sIu-L ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
;K4uu<e\ ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
U.I7p ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
d@b2XCh<K ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
B|M@o^Tf ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
[a~@6*= AST(Average Seek time,平均寻道时间)
_~P&8 ATA(AT Attachment,AT扩展型)
SD@ 0X[ ATAPI(AT Attachment Packet Interface)
:2wT)w z ATC(Access Time from Clock,时钟存取时间)
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' ATL: ActiveX Template Library(ActiveX模板库)
8|L 5nQ ATM(Asynchronous Transfer Mode,异步传输模式)
i3$G)W ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
Es\J%*\u ATX: AT Extend(扩展型AT)
%t74*cX Auxiliary Input(辅助输入接口)
yWT1CID AV(Analog Video,模拟视频)
}6{00er AVI(Audio Video Interleave,音频视频插入)
wM-H5\9n Back Buffer,后置缓冲
nhZ/^`Y< Backface culling(隐面消除)
=`CK`x BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
TXs&*\ Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
R;&k/v BCF(Boot Catalog File,启动目录文件)
IEkbVIA( Benchmarks:基准测试程序数值
G$CSZrP. BGA(Ball Grid Array,球状矩阵排列)
e~R_ bBQ0 BGA(Ball Grid Array,球状矩阵排列)
n%02,pC6, BGA: Ball Grid Array(球状网格阵列)
~~t>; BHT(branch prediction table,分支预测表)
xsS;<uCD BIF(Boot Image File,启动映像文件)
+<B"g{dLuX Bilinear Filtering(双线性过滤)
D})12qB;u9 BIOS(Basic Input/Output System,基本输入/输出系统)
N\?__WlBK7 BLA: Bearn Landing Area(电子束落区)
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BMC(Black Matrix Screen,超黑矩阵屏幕)
?UeV5<TewS BOD(Bandwidth On Demand,弹性带宽运用)
qn}VW0! BOPS:Billion Operations Per Second,十亿次运算/秒
KO"+"1 . bps(bit per second,位/秒)
Lso%1M BPU(Branch Processing Unit,分支处理单元)
T5:xia>8O Brach Pediction(分支预测)
jj 'epbA BSD(Berkeley Software Distribution,伯克利软件分配代号)
*Z2Ko5&Y2 BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
K,*z8@ BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
AOV{@b( C2C: card-to-card interleaving,卡到卡交错存取
QXy=| CAD: computer-aided design,计算机辅助设计
`v2Xp3o4f CAM(Common Access Model,公共存取模型)
Jv]$@># CAS(Column Address Strobe,列地址控制器)
L[`8 :}M CBR(Committed Burst Rate,约定突发速率)
6UqDpL7^U CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
KhL%ov CCD(Charge Coupled Device,电荷连接设备)
:}gEt?TUhs CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
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nHd CCM(Call Control Manager,拨号控制管理)
V<ilv< cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
G2P:|R CCS(Cut Change System)
p&HO~J<w CCT(Clock Cycle Time,时钟周期)
$}us+hGZ CDR(CD Recordable,可记录光盘)
5EECr
\* CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
P1Iy>%3 CDRW(CD-Rewritable,可重复刻录光盘)
N!-P2) @ CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
={o)82LV CE(Consumer Electronics,消费电子)
Fp]ErDan CEM(cube environment mapping,立方环境映射)
WH Ul.h Center Processing Unit Utilization,中央处理器占用率
Cyo:Da
A CEO(Chief Executive Officer,首席执行官)
S&J5QZjC CG(Computer Graphics,计算机生成图像)
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xi@7%& CGI(Common Gateway Interface,通用网关接口)
}-9 c1&m CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
-"#jRP]# CIEA: Commercial Internet Exchange Association,商业因特网交易协会
zpzxCzU CIR(Committed Infomation Rate,约定信息速率)
#n|eq{fkK CISC(Complex Instruction Set Computing,复杂指令集计算机)
Tv~Ho&LS CISC(Complex Instruction Set Computing,复杂指令集计算机)
<l eE.hhf. CISC: Complex Instruction Set Computing(复杂指令结构)
g+?2@L$L Clipping(剪贴纹理)
0c,!<\B CLK(Clock Cycle,时钟周期)
t7,$u- Clock Synthesizer,时钟合成器
Dg}EI^ d CLV(Constant Linear Velocity,恒定线速度)
)FfS7 C\. CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
3'SN0VL CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
_|;{{8*? CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
LE?sAN COB(Cache on board,板上集成缓存)
<$K7f COB(Cache on board,板上集成缓存)
7[0CVWs, COD(Cache on Die,芯片内集成缓存)
i4M%{]G3Y COD(Cache on Die,芯片内集成缓存)
-uhVw_qq# COM: Component Object Model(组件对象模式)
OO,EUOh-T: COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
=hI;5KF compressed textures(压缩纹理)
$)6M@S Concurrent Command Engine,协作命令引擎
\pP1k.~UnC COO(Chief Organizer Officer,首席管理官)
tOo\s&j CP: Ceramic Package(陶瓷封装)
E#!.;AQ CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
3|EAOoWnK CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
VM;vLUu!e CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
6(ER$ CPS: Certification Practice Statement(使用证明书)
'#Do( U' CPU(Center Processing Unit,中央处理器)
UoSc<h| CPU: Centerl Processing Unit(中央处理器)
u0qTP] CPU:Center Processing Unit,中央处理器
>Qg-dJt[ CRC: Cyclical Redundancy Check(循环冗余检查)
-av=5hm CRT(Cathode Ray Tube,阴极射线管)
Q"3gvIyc CS(Channel Separation,声道分离)
jBd=!4n CSE(Configuration Space Enable,可分配空间)
DV)NY! CSS(Common Command Set,通用指令集)
Q~KzcB< CSS: Cascading Style Sheets,层叠格式表
i8f +woZL CTO(Chief Technology Officer,首席技术官)
IfY?P(P CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
d\8j!F^= CTS(Clear to Send,清除发送)
a=6@} l1< CVS(Compute Visual Syndrome,计算机视觉综合症)